English  |  正體中文  |  简体中文  |  2831685  
???header.visitor??? :  33340556    ???header.onlineuser??? :  628
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"yang wen lin"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-8 of 8  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
國立交通大學 2017-04-21T06:55:15Z Optimal and heuristic algorithms for all-optical group multicast in resource-constrained WDM networks Yang, Wen-Lin; Yang, Chun-Tao; Huang, Yu-Chung
國立交通大學 2014-12-08T15:41:14Z A Third-Order Continuous-Time Sigma-Delta Modulator for Bluetooth Yang, Wen-Lin; Hsieh, Wen-Hung; Hung, Chung-Chih
元智大學 2012-08-03 Design and development of Kinect-based exergame for balance control training Tien-Lung Sun; Huang, Chien-Hua; Yang, Wen-Lin
東海大學 2010 以分散式液液微萃取結合基質輔助雷射脫附游離飛行時間質譜法應用於強心配醣體化合物的偵測 楊汶陵; Yang, Wen-Lin
淡江大學 2009 蕭蕭詩作探究 楊雯琳; Yang, Wen-lin
國立成功大學 2006-08 Underfill of flip-chip: The effect of contact angle and solder bump arrangement Young, Wen-Bin; Yang, Wen-Lin
國立成功大學 2002-12 Underfill viscous flow between parallel plates and solder bump Young, Wen-Bin; Yang, Wen-Lin
國立成功大學 2002-11 The effect of solder bump pitch on the underfill flow Young, Wen-Bin; Yang, Wen-Lin

Showing items 1-8 of 8  (1 Page(s) Totally)
1 
View [10|25|50] records per page