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Showing items 1-10 of 18 (2 Page(s) Totally)
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| 國立交通大學 |
2020-10-05T02:01:56Z |
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2020-07-01T05:21:48Z |
Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
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Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:14Z |
Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration
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Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
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Chi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
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Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang |
| 國立交通大學 |
2018-08-21T05:56:39Z |
An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System
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Hu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:55Z |
An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
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Hu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:17Z |
Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration
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Shen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng |
Showing items 1-10 of 18 (2 Page(s) Totally)
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