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Showing items 1-22 of 22 (1 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
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TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Characterization of thin films and intermetallic compounds in solder joint
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Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
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Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
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Chuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques
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TUNG-HAN CHUANG; Chuang, T.H.; Yen, S.F.; Wu, E.; Tsai, I. |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
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Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG |
| 國立成功大學 |
2019 |
Expression of AHI1 Rescues Amyloidogenic Pathology in Alzheimer’s Disease Model Cells
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Ting, L.-L.;Lu, H.-T.;Yen, S.-F.;Ngo, T.H.;Tu, F.-Y.;Tsai, I.-S.;Tsai, Y.-H.;Chang, F.-Y.;Li, X.-J.;Li, S.;Lee, C.-K.;Kao, S.-H.;Kuo, Y.-M.;Lin, Y.-F. |
| 國立臺灣科技大學 |
2017 |
Efficient cloud image retrieval system using weighted- inverted index and database filtering algorithms
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Yen, S.-F.;Chen, J.-J.;Tsai, Y.-H. |
| 國立臺灣大學 |
2007 |
Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints
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Chuang, T. H.; Yen, S. F. |
| 國立成功大學 |
2006-07 |
Analysis of the influence of therapy and viral suppression on high-risk sexual behaviour and sexually transmitted infections among patients infected with human immunodeficiency virus in Taiwan
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Chen, S. C.; Wang, S. T.; Chen, Kow-Tong; Yan, T. R.; Tang, Li-Hui; Lin, C. C.; Yen, S. F. |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F. |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
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Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 國立臺灣大學 |
2004 |
Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints
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Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J. |
| 臺大學術典藏 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH |
| 臺大學術典藏 |
2004 |
Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))
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Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
1994 |
Purification and Charaterization of Rice Sucrose Synthase Isozymes
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Yen, S. F.; Su, J. C.; 宋賢一; Yen, S. F.; Su, J. C.; Sung, Hsien-Yi |
Showing items 1-22 of 22 (1 Page(s) Totally)
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