臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
東方設計學院	2017-07	鶯歌陶藝產品設計魅力因子之探討 -以咖啡杯為例	許祐嘉; Yu-Chia Hsu; (東方設計學院文化創意設計研究所)
國立交通大學	2014-12-12T02:27:57Z	結合小波分解和小波神經網路於非定性財務時間序列之預測	許育嘉; Yu-Chia Hsu; 陳安斌; An-Pin Chen
國立交通大學	2014-12-12T02:24:31Z	小波神經網路於土木工程之應用	許育嘉; Yu-Chia Hsu; 洪士林; Shih-Lin Hung
亞洲大學	2011-05	Manufacturing Technique and Property Evaluation of Polypropylene/Carbon Fiber Composite Braids	Jia Horng Lin;Jin Mao Chen;Ching Wen Lin;Wen Hao Hsing;Yu Chia Hsu;Ching Wen Lou
義守大學	2008-08	Finite Element Prediction of Stack-Die Packages under Board Level Drop Test	Hsiang-Chen Hsu;Yu-Chia Hsu;Chan-Lin Yeh;Yi-Shao Lai
育達商業科技大學	2007	Pricing European Options with Actual Implied Volatility Distributions	邱筱雅;盛介中;Chieh-Chung ,Sheng;Hsiao-Ya ,Chiu;Yu-Chia ,Hsu;An-Pin ,Chen
義守大學	2006/12/11	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu
義守大學	2006/12/06	Application of submodeling technique to transient drop impact analysis of board-level stacked die packages	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hui-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2006/08/26	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學	2006-12	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu
義守大學	2006-08	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學	2006	運用子模型技術預測堆疊晶片構裝動態掉落測試之可靠度分析	許育嘉; Yu-Chia Hsu
義守大學	2005-12	Reliability and thermal structure design for CMOS image sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang

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