|
English
|
正體中文
|
简体中文
|
2823024
|
|
???header.visitor??? :
30268642
???header.onlineuser??? :
971
???header.sponsordeclaration???
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"yu jin"???jsp.browse.items-by-author.description???
Showing items 1-7 of 7 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立成功大學 |
2022 |
Blockchain Power Trading and Energy Management Platform
|
Lin;Yu-Jin;Chen;Yu-Cheng;Zheng;Jun-Yi;Chu;Dan;Shao;Dan-Wei;Yang;Hong-Tzer |
國立成功大學 |
2022 |
Blockchain-Based Intelligent Charging Station Management System Platform
|
Lin;Yu-Jin;Chen;Yu-Cheng;Zheng;Jun-Yi;Shao;Dan-Wei;Chu;Dan;Yang;Hong-Tzer |
淡江大學 |
2020-10-07 |
Finding Optimal Mid-Infrared Nonlinear Optical Materials in Germanates by First-Principles High-Throughput Screening and Experimental Verification
|
Yu, Jin;Zhang, Bingbing;Zhang, Xiaodong;Wang, Ying;Wu, Kui;Lee, Ming-Hsien |
淡江大學 |
2020-08-11 |
First-Principles High-Throughput Screening Pipeline for Nonlinear Optical Materials: Application to Borates
|
Zhang, Bingbing;Zhang, Xiaodong;Yu, Jin;Wang, Ying;Wu, Kui;Lee, Ming-Hsien |
國立交通大學 |
2020-05-05T00:01:28Z |
Fabrication of functionally radial graded metallic foam
|
Zang Xiao-yun; Wang Ke; He Si-yuan; Liu Jia-gui; Zhao Wei; Gong Xiao-lu; Yu Jin; Zhang Yi |
國立成功大學 |
2004-12 |
Special issue on lead-free solders and processing issues relevant to microelectronic packaging - Foreword
|
Chada, Srinivas; Turbini, Laura J.; Kang, Sung K.; Lin, Kwang-Lung; Notis, Michael R.; Yu, Jin |
國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
|
Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
Showing items 1-7 of 7 (1 Page(s) Totally) 1 View [10|25|50] records per page
|