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Showing items 1-11 of 11  (1 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2005-03-08 Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface Wang, Moo-Chin; Yu, Shan-Pu; Chang, Tao-Chih; Hon, Min-Hsiung
國立成功大學 2004-11-03 Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface Wang, Moo-Chin; Yu, Shan-Pu; Chang, Tao-Chih; Hon, Min-Hsiung
國立成功大學 2002-01 Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate Yu, Shan-Pu; Wang, Hsin-Chien; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2001-09 Effect of process parameters on the properties of alumina-zirconia-graphite (AZG) refractories (part 2) - Baking temperature and time Yu, Shan-Pu; Yang, Ko-Ho; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2001-07 Effect of process parameters on the properties of alumina-zirconia-graphite refractories (Part 1) - Forming pressure and baking temperature Yu, Shan-Pu; Yang, Ko-Ho; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2001-01 Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface Yu, Shan-Pu; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2000-09 The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate Yu, Shan-Pu; Liao, Cheng-Lung; Hon, Min-Hsiung; Wang, Moo-Chin
國立成功大學 2000-08 Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate Yu, Shan-Pu; Lin, H. J.; Hon, Min-Hsiung; Wang, Moo-Chin
國立成功大學 2000-08 Properties of alumina-zirconia-graphite refractories with particle size according to the Andreasen model Yu, Shan-Pu; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2000-06 Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate Yu, Shan-Pu; Hon, Min-Hsiung; Wang, Hsin-Chien; Wang, Moo-Chin
國立成功大學 2000-02 The adhesion strength of a lead-free solder hot-dipped on copper substrate Yu, Shan-Pu; Hon, Min-Hsiung; Wang, Moo-Chin

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