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| 國立交通大學 |
2020-10-05T02:01:56Z |
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2020-10-05T02:01:28Z |
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Chung, Ying-Ting; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-03T06:48:03Z |
High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si Substrate
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Chi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-03T06:47:10Z |
High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding Technology
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Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
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Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 義守大學 |
2018-09 |
探討生化參數與640切CT冠狀動脈鈣化指數影像之相關性
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楊玉婷; Yu-Ting Yang |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
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Chen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
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Huang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
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Chi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng |
Showing items 1-10 of 19 (2 Page(s) Totally)
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