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Institution	Date	Title	Author
國立臺灣科技大學	2011	Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects	Leau, W.K.;Chu, J.P.;Lin, C.H.
元智大學	Jan-15	Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2013-12-1	Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations	C. H. Kao; H. H. Hua; H. Y. Chan; T. H. Yang; Kuen-Song Lin; Cheng-En Ho
元智大學	2013-12-1	Interfacial Reaction and Mechanical Reliability of PTH Solder Joints with Different Solder/Surface Finish Combinations	Kuen-Song Lin; Cheng-En Ho; Ho-Yang Chan; Shih-Ju Wang; Chin-Hung Kuo
國立交通大學	2014-12-08T15:16:20Z	Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization	Hsu, YC; Huang, YM; Chen, C; Wang, H
國立臺灣大學	2012	Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating	Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.
臺大學術典藏	2018-09-10T09:17:50Z	Interfacial reaction and wettability of 72Ag-28Cu braze on CP-Ti substrate using infrared heating	Lin, Ming-Tsan;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;陳炯年;李伯皇;楊博仁;楊偉勛;林明燦;Yu, Linda Chia-Hui;Lee, Po-Huang;Chen, Chiung-Nien;Yang, T.E.;Chen, F.Y.;Nien, Hsiao-Ching;Wu, S.K.;Yang, Wei-Shiung;Shiue, R.K.;SHYI-KAAN WU;Yang, Po-Jen; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Yang, Po-Jen; SHYI-KAAN WU; Shiue, R.K.; Yang, Wei-Shiung; Wu, S.K.; Nien, Hsiao-Ching; Chen, F.Y.; Yang, T.E.; Chen, Chiung-Nien; Lee, Po-Huang; Yu, Linda Chia-Hui; Lin, Ming-Tsan; 林明燦; 楊偉勛; 楊博仁; 李伯皇; 陳炯年
國立臺灣大學	2010	Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints	Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R.
臺大學術典藏	2020-04-28T07:11:48Z	Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints	Chang, C. C.; Wang, Y. W.; Lai, Y. S.; Kao, C. R.; CHIEN-CHENG CHANG

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