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Institution	Date	Title	Author
國立勤益科技大學	1999-06	Intermetallic phase formation and shear strength of a Au-In microjoint	Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C.
國立成功大學	2014	Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure	Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen
臺大學術典藏	2018-06-28T22:11:31Z	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
國立臺灣大學	2005	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
臺大學術典藏	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
國立臺灣大學	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:11Z	Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish	Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG
國立臺灣大學	2008	Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
臺大學術典藏	2020-05-12T02:53:12Z	Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2006	Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads	TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J.
臺大學術典藏	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	Chuang, T.H.; Jain, C.C.; Wu, H.M.
臺大學術典藏	2009-01-06T01:28:22Z	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chi, Chih-Chien; Chuang, Tung-Han
臺大學術典藏	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth
國立臺灣大學	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
臺大學術典藏	2020-05-12T02:53:13Z	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG
國立成功大學	2012-10	Intermetallic solid solution Fe1-xCoxGa3: Synthesis, structure, NQR study and electronic band structure calculations	Verchenko, V. Yu; Likhanov, M. S.; Kirsanova, M. A.; Gippius, A. A.; Tkachev, A. V.; Gervits, N. E.; Galeeva, A. V.; Buettgen, N.; Kraetschmer, W.; Lue, C. S.; Okhotnikov, K. S.; Shevelkov, A. V.
嘉南藥理大學	2009	Intermetallics	Elsevier SDOL
國立臺灣大學	1991-06	Intermetallics Research and Development in Taiwan, R. O. C.	許樹恩; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; 吳錫侃; Hsu, Shu-En; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; Wu, Shyi-Kaan
中國文化大學	2011-12	Intermetropolitan Networks of Co-invention in American Biotechnology	李德軒

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