| 國立成功大學 |
2021-09-15 |
Materials and electrode designs of high-performance NiCo2S4/Reduced graphene oxide for supercapacitors
|
Hsiang;Hsing-;I;She;Cheng-Hsuan;Chung;Sheng-Heng |
| 亞洲大學 |
2015/01 |
MATERIALS AND MANUFACTURING PROCESSES
|
于志財; Yu, Zhi-Cai;,張劍飛 ;Zhang,Jian-Fei; 樓靜文 Lou,Ching-Wen; 林佳弘 Lin,Jia-Horng |
| 臺大學術典藏 |
2018-09-10T07:34:10Z |
Materials and tunneling characteristics of HTSC Y sub (1) Ba sub (2) Cu sub (3) O sub (7-x) thin films by molecular beam epitaxy.
|
Kwo, J;Hong, M;Fulton, T; Kwo, J; Hong, M; Fulton, T; MINGHWEI HONG |
| 臺大學術典藏 |
2018-09-10T03:28:30Z |
Materials and Tunneling Characteristics of HTSC Y1Ba2Cu3O7-x Thin Films by Molecular Beam Epitaxy
|
Kwo, J;Hong, Minghwei;Fulton, TA;Gammel, PL;Mannaerts, JP; Kwo, J; Hong, Minghwei; Fulton, TA; Gammel, PL; Mannaerts, JP; MINGHWEI HONG |
| 國立交通大學 |
2015-07-21T08:28:39Z |
Materials challenges in three-dimensional integrated circuits
|
Chen, Kuan-Neng; Tu, King-Ning |
| 國立臺灣科技大學 |
2010 |
Materials Characteristics and Electric Performance of SiOX Addition in GDC Electrolytes
|
Su, Yu-Ming; Kung, Fu-Chen; Su, Te-Li; Tsai, Pi-Chen; Lai, Chin-Chun; Kuo, Yu-Lin |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
|
Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 嘉南藥理大學 |
2009 |
Materials Characterization
|
Elsevier SDOL |
| 嘉南藥理大學 |
2009 |
Materials Chemistry and Physics
|
Elsevier SDOL |
| 臺大學術典藏 |
2021-08-05T02:37:49Z |
Materials Design and Optimization for Next-Generation Solar Cell and Light-Emitting Technologies
|
Manzhos S;Chueh C.-C;Giorgi G;Kubo T;Saianand G;L?der J;Sonar P;Ihara M.; Manzhos S; Chueh C.-C; Giorgi G; Kubo T; Saianand G; L?der J; Sonar P; Ihara M.; CHU-CHEN CHUEH |
| 國立政治大學 |
2006-11 |
Materials Design for Lecture Listening in EAP
|
林翰儀 |
| 國立高雄第一科技大學 |
2002.12 |
Materials Development and Task Design for an MT Course
|
Shih, Chung-Ling; 史宗玲 |
| 臺大學術典藏 |
2021-09-14T23:19:23Z |
Materials Engineering of Violin Soundboards by Stradivari and Guarneri
|
Su, Cheng Kuan; Chen, Szu Yu; Chung, Jen Hsuan; Li, Guo Chian; Brandmair, Brigitte; Huthwelker, Thomas; Fulton, John L.; Borca, Camelia N.; Huang, Shing Jong; Nagyvary, Joseph; Tseng, Hsiao Han; Chang, Chih Hui; Chung, Dai Ting; Vescovi, Rafael; Tsai, Yi Shiuan; Cai, Wenjie; Lu, Bing Jyun; Xu, Jia Wei; Hsu, Chia Shuo; Wu, Jun Jie; Li, Hao Zhi; Jheng, Yu Kai; Lo, Sheng Fong; HAO MING CHEN; Hsieh, Yi Ting; Chung, Po Wen; Chen, Chien Sheng; Sun, Yuh Chang; Chan, Jerry Chun Chung; HWAN-CHING TAI |
| 臺大學術典藏 |
2022-04-25T06:38:55Z |
Materials Engineering of Violin Soundboards by Stradivari and Guarneri
|
Su C.-K;Chen S.-Y;Chung J.-H;Li G.-C;Brandmair B;Huthwelker T;Fulton J.L;Borca C.N;Huang S.-J;Nagyvary J;Tseng H.-H;Chang C.-H;Chung D.-T;Vescovi R;Tsai Y.-S;Cai W;Lu B.-J;Xu J.-W;Hsu C.-S;Wu J.-J;Li H.-Z;Jheng Y.-K;Lo S.-F;Chen H.M;Hsieh Y.-T;Chung P.-W;Chen C.-S;Sun Y.-C;Chan J.C.C;Tai H.-C.; Su C.-K; Chen S.-Y; Chung J.-H; Li G.-C; Brandmair B; Huthwelker T; Fulton J.L; Borca C.N; Huang S.-J; Nagyvary J; Tseng H.-H; Chang C.-H; Chung D.-T; Vescovi R; Tsai Y.-S; Cai W; Lu B.-J; Xu J.-W; Hsu C.-S; Wu J.-J; Li H.-Z; Jheng Y.-K; Lo S.-F; Chen H.M; Hsieh Y.-T; Chung P.-W; Chen C.-S; Sun Y.-C; Chan J.C.C; Tai H.-C.; CHUN-CHUNG CHAN |
| 臺大學術典藏 |
2022-04-25T06:39:02Z |
Materials Engineering of Violin Soundboards by Stradivari and Guarneri
|
Su C.-K;Chen S.-Y;Chung J.-H;Li G.-C;Brandmair B;Huthwelker T;Fulton J.L;Borca C.N;Huang S.-J;Nagyvary J;Tseng H.-H;Chang C.-H;Chung D.-T;Vescovi R;Tsai Y.-S;Cai W;Lu B.-J;Xu J.-W;Hsu C.-S;Wu J.-J;Li H.-Z;Jheng Y.-K;Lo S.-F;Chen H.M;Hsieh Y.-T;Chung P.-W;Chen C.-S;Sun Y.-C;Chan J.C.C;Tai H.-C.; Su C.-K; Chen S.-Y; Chung J.-H; Li G.-C; Brandmair B; Huthwelker T; Fulton J.L; Borca C.N; Huang S.-J; Nagyvary J; Tseng H.-H; Chang C.-H; Chung D.-T; Vescovi R; Tsai Y.-S; Cai W; Lu B.-J; Xu J.-W; Hsu C.-S; Wu J.-J; Li H.-Z; Jheng Y.-K; Lo S.-F; Chen H.M; Hsieh Y.-T; Chung P.-W; Chen C.-S; Sun Y.-C; Chan J.C.C; Tai H.-C.; HWAN-CHING TAI |
| 臺大學術典藏 |
2022-04-25T06:38:57Z |
Materials Engineering of Violin Soundboards by Stradivari and Guarneri
|
Su C.-K;Chen S.-Y;Chung J.-H;Li G.-C;Brandmair B;Huthwelker T;Fulton J.L;Borca C.N;Huang S.-J;Nagyvary J;Tseng H.-H;Chang C.-H;Chung D.-T;Vescovi R;Tsai Y.-S;Cai W;Lu B.-J;Xu J.-W;Hsu C.-S;Wu J.-J;Li H.-Z;Jheng Y.-K;Lo S.-F;Chen H.M;Hsieh Y.-T;Chung P.-W;Chen C.-S;Sun Y.-C;Chan J.C.C;Tai H.-C.; Su C.-K; Chen S.-Y; Chung J.-H; Li G.-C; Brandmair B; Huthwelker T; Fulton J.L; Borca C.N; Huang S.-J; Nagyvary J; Tseng H.-H; Chang C.-H; Chung D.-T; Vescovi R; Tsai Y.-S; Cai W; Lu B.-J; Xu J.-W; Hsu C.-S; Wu J.-J; Li H.-Z; Jheng Y.-K; Lo S.-F; Chen H.M; Hsieh Y.-T; Chung P.-W; Chen C.-S; Sun Y.-C; Chan J.C.C; Tai H.-C.; HAO MING CHEN |
| 國立臺北護理健康大學 |
2005 |
Materials Flow Analysis of Pollutants in Taiwan
|
郭乃文; Hsiao, Teng-Yuan;Kuo, Nae-Wen;Iddo, K.Wernick;Lu, Li-The;Yu, Yue-Hwa |
| 臺大學術典藏 |
2018-09-10T09:44:33Z |
Materials for the active layer of organic photovoltaics: Ternary solar cell approach
|
Hsu, C.-Y.; Lin, R.Y.-Y.; Ho, K.-C.; Lin, J.T.; KUO-CHUAN HO; Chen, Y.-C.; KUO-CHUAN HO;Lin, J.T.;Ho, K.-C.;Lin, R.Y.-Y.;Hsu, C.-Y.;Chen, Y.-C. |
| 國立臺灣大學 |
1987 |
Materials for the Fungal Flora of Taiwan(I)
|
Tseng, H. Y.; 陳瑞青; Tseng, H. Y.; Chen, Zuei-Ching |
| 國立臺灣大學 |
1990-01 |
Materials for the Lomariopsidaceae of Taiwan.
|
Kuo CM |
| 國立成功大學 |
2020-09-1 |
Materials genome evolution of surface plasmon resonance characteristics of Au nanoparticles decorated ZnO nanorods
|
Yen;Sheng-Che;Chen;Yu-Lin;Su;Yen-Hsun |
| 國立交通大學 |
2017-04-21T06:55:14Z |
Materials growth and band offset determination of Al2O3/In0.15Ga0.85Sb/GaSb/GaAs heterostructure grown by metalorganic chemical vapor deposition
|
Sa Hoang Huynh; Minh Thien Huu Ha; Huy Binh Do; Tuan Anh Nguyen; Quang Ho Luc; Chang, Edward Yi |
| 國立臺灣大學 |
1989 |
Materials Handling:The Greenhouse (Labor) Energy Crises of the 1990's
|
Giacomelli, G. A.; Ting, K. C.; 方煒; Giacomelli, G. A.; Ting, K. C.; Fang, Wei |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages
|
C. ROBERT KAO;Kao C.R.;Tsai J.;Lin Y.L.; Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 嘉南藥理大學 |
2009 |
Materials Letters
|
Elsevier SDOL |
