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显示项目 254666-254675 / 2348973 (共234898页)
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机构 日期 题名 作者
國立臺灣大學 2011 Chip Implementation with a Combined Wireless Temperature Sensor and Reference Devices Based on the DZTC Principle Chang, Ming-Hui; Huang, Yu-Jie; Huang, Han-Pang; Lu, Shey-Shi
國立臺灣大學 2010 Chip implementation with combined temperature sensor and reference devices based on DZTC principle Chang, M-H.; Liu, C-P.; Huang, H-P.
臺大學術典藏 2020-01-13T08:18:25Z Chip implementation with combined temperature sensor and reference devices based on DZTC principle Chang, M.-H.; Liu, C.-P.; Huang, H.-P.; HAN-PANG HUANG
亞洲大學 2013.10 CHIP inhibits lipopolysaccharide-induced cardiomyocyte hypertrophy by promoting the proteasomal degradation of NFATc3. 黃志揚;HUANG, CHIH-YANG
國立交通大學 2014-12-08T15:26:06Z Chip interleaving for performance improvement of coded DS-CDMA systems in Rayleigh fading channels Lin, YN; Lin, DW
臺大學術典藏 2020-06-16T06:35:54Z Chip Last Fan-Out Packaging for Millimeter Wave Application Lu, H.-C.;Wang, Y.-H.;Leou, J.-L.;Chan, H.;Chen, S.; Lu, H.-C.; Wang, Y.-H.; Leou, J.-L.; Chan, H.; Chen, S.; HSIN-CHIA LU
國立成功大學 2018-11-26 Chip packaging device and alignment bonding method thereof Hsieh, Po-Tsung;Yang, Chia-Ming;Chen, In-Gann;Tseng, Shih-Wen;Tsai, Ya-Wen;Chuang, Ya-Wen
臺大學術典藏 2021-09-02T00:04:08Z Chip Performance Prediction Using Machine Learning Techniques Su M.-Y;Lin W.-C;Kuo Y.-T;Li C.-M;Fang E.J.-W;Hsueh S.S.-Y.; Su M.-Y; Lin W.-C; Kuo Y.-T; Li C.-M; Fang E.J.-W; Hsueh S.S.-Y.; CHIEN-MO LI
義守大學 2013-08 Chip placement design in capacitive proximity communication Yu-Jung Huang
元智大學 2008-01 Chip placement in a reticle for multiple-project wafer fabrication 林榮彬; Meng-Chiou Wu; Shih-Cheng Tsai

显示项目 254666-254675 / 2348973 (共234898页)
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每页显示[10|25|50]项目