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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 254666-254675 / 2348973 (共234898页) << < 25462 25463 25464 25465 25466 25467 25468 25469 25470 25471 > >> 每页显示[10|25|50]项目
| 國立臺灣大學 |
2011 |
Chip Implementation with a Combined Wireless Temperature Sensor and Reference Devices Based on the DZTC Principle
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Chang, Ming-Hui; Huang, Yu-Jie; Huang, Han-Pang; Lu, Shey-Shi |
| 國立臺灣大學 |
2010 |
Chip implementation with combined temperature sensor and reference devices based on DZTC principle
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Chang, M-H.; Liu, C-P.; Huang, H-P. |
| 臺大學術典藏 |
2020-01-13T08:18:25Z |
Chip implementation with combined temperature sensor and reference devices based on DZTC principle
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Chang, M.-H.; Liu, C.-P.; Huang, H.-P.; HAN-PANG HUANG |
| 亞洲大學 |
2013.10 |
CHIP inhibits lipopolysaccharide-induced cardiomyocyte hypertrophy by promoting the proteasomal degradation of NFATc3.
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黃志揚;HUANG, CHIH-YANG |
| 國立交通大學 |
2014-12-08T15:26:06Z |
Chip interleaving for performance improvement of coded DS-CDMA systems in Rayleigh fading channels
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Lin, YN; Lin, DW |
| 臺大學術典藏 |
2020-06-16T06:35:54Z |
Chip Last Fan-Out Packaging for Millimeter Wave Application
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Lu, H.-C.;Wang, Y.-H.;Leou, J.-L.;Chan, H.;Chen, S.; Lu, H.-C.; Wang, Y.-H.; Leou, J.-L.; Chan, H.; Chen, S.; HSIN-CHIA LU |
| 國立成功大學 |
2018-11-26 |
Chip packaging device and alignment bonding method thereof
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Hsieh, Po-Tsung;Yang, Chia-Ming;Chen, In-Gann;Tseng, Shih-Wen;Tsai, Ya-Wen;Chuang, Ya-Wen |
| 臺大學術典藏 |
2021-09-02T00:04:08Z |
Chip Performance Prediction Using Machine Learning Techniques
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Su M.-Y;Lin W.-C;Kuo Y.-T;Li C.-M;Fang E.J.-W;Hsueh S.S.-Y.; Su M.-Y; Lin W.-C; Kuo Y.-T; Li C.-M; Fang E.J.-W; Hsueh S.S.-Y.; CHIEN-MO LI |
| 義守大學 |
2013-08 |
Chip placement design in capacitive proximity communication
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Yu-Jung Huang |
| 元智大學 |
2008-01 |
Chip placement in a reticle for multiple-project wafer fabrication
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林榮彬; Meng-Chiou Wu; Shih-Cheng Tsai |
显示项目 254666-254675 / 2348973 (共234898页) << < 25462 25463 25464 25465 25466 25467 25468 25469 25470 25471 > >> 每页显示[10|25|50]项目
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