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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 254696-254705 / 2349007 (共234901页)
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| 國立高雄師範大學 |
2005-06 |
Chip-package-board codesign of highly linear 3G-CDMA upconverter modules
|
Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘 |
| 國立高雄師範大學 |
2005-10 |
Chip-Package-Board Codesign of W-CDMA RFICs
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Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘 |
| 國立中山大學 |
2005-10 |
Chip-Package-Board Codesign of W-CDMA RFICs
|
F.Y. Han;J.M. Wu;T.S. Horng |
| 國立交通大學 |
2017-04-21T06:49:57Z |
Chip-Scale Nanophotonic Chemical and Biological Sensors using CMOS Process
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Bollschweiler, Lincoln; English, Alex; Baker, R. Jacob; Kuang, Wan; Chang, Zi-Chang; Shih, Ming-Hsiung; Knowlton, William B.; Hughes, William L.; Lee, Jeunghoon; Yurke, Bernard; Cockerham, Nankyung Suh; Tyree, Vance C. |
| 國立交通大學 |
2019-04-03T06:47:17Z |
Chip-size wavelength detector based on a gradient grating period guided-mode resonance filter
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Lin, Hsin-An; Hsu, Hsin-Yun; Huang, Cheng-Sheng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2014-12-16T06:14:02Z |
Chip-to-chip multi-signaling communication system with common conductive layer
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Su Chau-Chin; Ho Ying-Chieh; Huang Po-Hsiang |
| 國立交通大學 |
2014-12-16T06:15:14Z |
CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDUCTIVE LAYER
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SU Chau-Chin; Ho Ying-Chieh; Huang Po-Hsiang |
| 南台科技大學 |
2004 |
Chip123 電子平台解決方案
|
李博明 |
| 國立臺灣大學 |
1986-09 |
Chipan Hydroelectric Project:Hydraulic Model Studies on Kuyuan Dam
|
王如意; Yen, Chin-Lien; Wang, Ru-Yih; Yen, Chin-Lien |
显示项目 254696-254705 / 2349007 (共234901页)
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