| 國立臺灣科技大學 |
2020 |
Etch-stop process for precisely controlling the vertical cavity length of GaN-based devices
|
Liu, Y.-Y.;Wu, T.-C.;Yeh, P.S. |
| 中國醫藥大學 |
2009-06-28 |
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography
|
陳建良(Jian-Lian Chen)* |
| 中國醫藥大學 |
|
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography.
|
陳建良(Jian-Lian Chen)* |
| 中國醫藥大學 |
2009-12 |
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography.
|
陳建良(Jian-Lian Chen)* |
| 國立彰化師範大學 |
1985-01 |
Etched-coupled cavity InGaAsP/InP lasers
|
Chen, Kuo-Liang; Wang, Shyh |
| 國立中山大學 |
2000 |
Etching Characteristics and Mechanism of Ba0.7Sr0.3TiO3 Thin Films in an Inductively Coupled Plasma
|
D.S. Wuu; F.C. Liao; N.H. Kuo; R.H. Horng; M.K. Lee |
| 中原大學 |
2000 |
Etching Characteristics of Organic Low-k Dielectrics in the Helicon-wave Plasma Etcher for 0.15 μm Damascene Architecture.
|
J.M. Shieh;T.C. Wei;C.H. Liu;S.C. Suen;B.T. Dai |
| 臺大學術典藏 |
2018-09-10T07:09:06Z |
Etching Characteristics of SiNx Films for DUV Lithography Applications
|
L. A. Wang; LON A. WANG; H. L. Chen |
| 國立交通大學 |
2014-12-08T15:40:39Z |
Etching damages on AlGaN, GaN and InGaN caused by hybrid inductively coupled plasma etch and photoenhanced chemical wet etch by Schottky contact characterizations
|
Fang, CY; Huang, WJ; Chang, EY; Lin, CF; Feng, MS |
| 國立交通大學 |
2014-12-16T06:14:21Z |
Etching method for nitride semiconductor
|
Lee; Wei-I; Huang; Hsin-Hsiung; Zeng; Hung-Yu |
| 國立交通大學 |
2014-12-16T06:15:50Z |
Etching method for nitride semiconductor
|
Lee, Wei-I; Huang, Hsin-Hsiung; Zeng, Hung-Yu |
| 國立交通大學 |
2014-12-08T15:07:16Z |
Etching of GaN by microwave plasma of hydrogen
|
Tiwari, Rajanish N.; Chang, Li |
| 國立中山大學 |
2001 |
Etching of platinum thin films in an inductively coupled plasma
|
D.S. Wuu; H.H. Kuo; F.C. Liao; R.H. Horng; M.K. Lee |
| 國立交通大學 |
2014-12-08T15:02:34Z |
Etching of rf magnetron-sputtered indium tin oxide films
|
Chiou, BS; Lee, JH |
| 臺大學術典藏 |
2020-01-06T03:08:39Z |
Etching of ruthenium coatings in O 2- and Cl 2- containing plasmas
|
Hsu, C.C.; Coburn, J.W.; Graves, D.B.; JERRY CHENG-CHE HSU |
| 國立臺灣大學 |
1994 |
Etching of YBa2Cu3Oy surface by scanning tunneling microscope
|
Chen, S.; Wang, L.M.; Yang, H.C.; Horng, H.E. |
| 中原大學 |
2003-05-20 |
Etching process
|
Chen Bi-Ling;Jeng Erik S.;Liu Hao-Chieh |
| 國立臺灣大學 |
2005-03 |
Etching Submicrometer Trenches by Using the Bosch Process and its Application to the Fabrication of Antireflection Structures
|
Chang, C. L.; Wang, Y. F.; Kanamori, Yoshiaki; Shih, J. J.; Kawai, Yusuke; Lee, C. K.; Wu, K. C.; Esashi, Masayoshi |
| 臺大學術典藏 |
2018-09-10T05:21:42Z |
Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures
|
KUANG-CHONG WU; Esashi, M.; Wu, K.-C.; Lee, C.-K.; Kawai, Y.; Shih, J.-J.; Kanamori, Y.; Wang, Y.-F.; KUANG-CHONG WU;Esashi, M.;Wu, K.-C.;Lee, C.-K.;Kawai, Y.;Shih, J.-J.;Kanamori, Y.;Wang, Y.-F.;Chang, C.; Chang, C. |
| 臺大學術典藏 |
2020-04-28T07:12:30Z |
Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures
|
Chang, C.; Wang, Y.-F.; Kanamori, Y.; Shih, J.-J.; Kawai, Y.; Lee, C.-K.; Wu, K.-C.; Esashi, M.; CHIH-KUNG LEE |
| 中原大學 |
1997 |
Etching, Insertion, and Abstraction Reactions of Atomic Deuterium with Amorphous Silicon Hydride Films
|
C.-M. Chiang;S. M. Gates;Szetsen S. Lee;M. Kong;Stacey F. Bent |
| 中華大學 |
2010 |
ETCHING製版示例
|
雷, 驤 |
| 國立臺灣大學 |
2006-07 |
ETC判決與公益原則
|
林明鏘 |
| 中原大學 |
2006-04 |
ETC契約之公、私法性質爭議－以台北高等行政法院九四年停字第一二二號裁定與九四年訴字第七五二號判決為中心
|
江嘉琪 |
| 國立政治大學 |
2006-03 |
ETC案的爭議
|
黃明聖 |
