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显示项目 519911-519920 / 2349007 (共234901页)
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机构 日期 题名 作者
國立交通大學 2014-12-08T15:42:26Z Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC
臺大學術典藏 2011 Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學 2011 Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2011 Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
國立交通大學 2014-12-08T15:37:18Z Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures Chen, SY; Hsiao, CS; Hsu, JJ
元智大學 Sep-18 Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
國立成功大學 2006-09-28 Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste Shih, Po-Cheng; Lin, Kwang-Lung
國立成功大學 2011-04-29 Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu
淡江大學 2024-12-25 Interfacial microstructure in the reaction between BiIn solder and Cu substrate Wang, Yi-wun;Lin, Tzu-yi;Tsai, Cheng-ting
國立中山大學 2002 Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung

显示项目 519911-519920 / 2349007 (共234901页)
<< < 51987 51988 51989 51990 51991 51992 51993 51994 51995 51996 > >>
每页显示[10|25|50]项目