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Showing items 263761-263770 of 2348881 (234889 Page(s) Totally) << < 26372 26373 26374 26375 26376 26377 26378 26379 26380 26381 > >> View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:02:01Z |
CMP of fluorinated silicon dioxide: Is it necessary and feasible?
|
Tseng, WT; Hsieh, YT; Lin, CF |
| 國立交通大學 |
2014-12-08T15:39:45Z |
CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications
|
Chang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, TY |
| 國立中山大學 |
2004 |
CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications
|
T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng |
| 國立交通大學 |
2014-12-08T15:39:42Z |
CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications
|
Chang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, T |
| 國立中山大學 |
2004 |
CMP of Ultra Low-k Material Porous-Polysilazane (PPSZ) for Interconnect Applications
|
T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng |
| 國立中山大學 |
2004 |
CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications
|
T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng |
| 國立中山大學 |
2004 |
CMP of ultra low-k Methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications
|
T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng |
| 國立臺灣科技大學 |
2015 |
CMP process - Integrated chemical & physical phenomena in between wafer and polishing pad
|
Kimura, Kimura K.;Chen, Chen C.-C.A. |
| 國立中山大學 |
2002 |
CMP Wastewater Management Using the Concepts of Design for Environment
|
C.C. Yang |
| 國立聯合大學 |
2010 |
CMP 污泥與MSWI 混合灰共融熔渣取代部份水泥之砂漿強度探討
|
賴昆敬;柳鴻明;蔡惠旻;詹文婷;李欣宜 |
Showing items 263761-263770 of 2348881 (234889 Page(s) Totally) << < 26372 26373 26374 26375 26376 26377 26378 26379 26380 26381 > >> View [10|25|50] records per page
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