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Showing items 374951-374975 of 2307912 (92317 Page(s) Totally)
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| 國立聯合大學 |
2006 |
Electrical Properties of TiO2 Films by Controlled Deposition of Sol-Gel Process
|
Y. W. Lin, Cheng-Shing Hsu, and P. C. Yao, |
| 國立交通大學 |
2014-12-08T15:02:23Z |
Electrical properties of ZnO varistors prepared by microwave sintering process
|
Chen, CS; Kuo, CT; Lin, IN |
| 大葉大學 |
2016-07-12 |
Electrical property improved of activate carbon based Supercapacitor by silver nanowires doping and ultrasonic spray process
|
Huang, Jung-Jie;Zhang, Yu-Xuan;Hsueh, Yu-Lee |
| 中原大學 |
1996-12 |
Electrical Property of GaN Thin Films Grown by Atmospheric Pressure OMCVD
|
Liao, S. M.;Wen, J. H.;Lan, S. M. |
| 淡江大學 |
2012-10 |
Electrical Pulse Triggered Reversible Assembly of Molecular Adlayers
|
Lee, Shern-Long; Hsu, Yu-Ju; Wu, Hung-Jen; Lin, Hsing-An; Hsu, Hsiu-Fu; Chen, Chun-hsien |
| 臺大學術典藏 |
2018-09-10T09:17:32Z |
Electrical pulse triggered reversible assembly of molecular adlayers
|
Lee, S. L.; Hsu, Y. J.; Wu, H. J.; Lin, H. A.; Hsu, H. F.; Chen, C. H.; CHUN-HSIEN CHEN |
| 國立交通大學 |
2014-12-08T15:27:01Z |
Electrical reliability issues of integrating low-K dielectrics with Cu metallization
|
Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS |
| 國立交通大學 |
2014-12-08T15:46:06Z |
Electrical reliability issues of integrating thin Ta and TaN barriers with Cu and low-K dielectric
|
Wu, ZC; Wang, CC; Wu, RG; Liu, YL; Chen, PS; Zhu, ZM; Chen, MC; Chen, JF; Chang, CI; Chen, LJ |
| 國立交通大學 |
2014-12-08T15:26:46Z |
Electrical reliability of low dielectric constant diffusion barrier (a-SiC : H) for copper interconnect
|
Fang, KL; Tsui, BY; Yang, CC; Lee, SD |
| 臺北醫學大學 |
2005 |
Electrical remodeling of the canine superior vena cava after chronic rapid atrial pacing.
|
陳亦仁; Lee SH; Chen YJ; Tai CT; Yeh HI; Cheng JJ; Hung CR; Chen SA. |
| 國立成功大學 |
2007-01 |
Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立交通大學 |
2014-12-08T15:37:18Z |
Electrical resistivities and thermopowers of transparent Sn-doped indium oxide films
|
Li, ZQ; Lin, JJ |
| 國立東華大學 |
2007 |
Electrical resistivity and interfacial behavior of Bi-Ag/Cu high temperature solder joints
|
Song,J. M.; Chuang,Hsin-Yi; Lew,Kar-Kit |
| 國立臺灣大學 |
1991 |
Electrical Resistivity and Magnetic Properties of Mn-Al Magnets
|
郭博成; Yao, Y. D.; Huang, J. H.; Chen, C. H.; Kuo, Po-Cheng; Yao, Y. D.; Huang, J. H.; Chen, C. H. |
| 淡江大學 |
1988-06-01 |
Electrical resistivity and magnetization studies of NdFeB system
|
Yao, Y. D.; Jen, S. U.; Chen, W. B.; Horng, J. I.; Wu , M. K. |
| 淡江大學 |
1998-10 |
Electrical resistivity and magnetization studies of the NdFeB system
|
姚永德; Yao, Yeong-der; 任盛源; Jen, S. U.; 陳武斌; Chen, W. B. |
| 國立臺灣大學 |
1990 |
Electrical Resistivity of Nickel-Rich Nickel-Indium Alloys between 10 and 800 K
|
Tzeng, S. J.; Yao, Y. D.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K
|
Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立中山大學 |
1991 |
Electrical resistivity of the heavy-fermion system CePtSi under pressure
|
H.D. Yang;W.H. Lee |
| 國立臺灣大學 |
1992 |
Electrical Resistivity of Ti 0.862Al 0.102V 0.036 Alloy between 4 and 1000 K
|
Tzeng, S. J.; Lin, J. J.; Yao, Y. D.; Chen, Y. Y. |
| 國立臺灣大學 |
2006 |
Electrical resistivity of Ti-Ni binary and Ti-Ni-X (X = Fe, Cu) ternary shape memory alloys
|
Wu, S.K.; Lin, H.C.; Lin, T.Y. |
| 臺大學術典藏 |
2018-09-10T05:52:02Z |
Electrical resistivity of Ti-Ni binary and Ti-Ni-X (X = Fe, Cu) ternary shape memory alloys
|
Wu, S.K.; Lin, H.C.; Lin, T.Y.; SHYI-KAAN WU |
| 國立臺灣大學 |
2006-12 |
Electrical Resistivity of TiNi Binary and TiNiX (X=Fe, Cu) Ternary Shape Memory Alloys
|
Wu, S.K.; Lin, H.C.; Lin, .Y. |
| 臺大學術典藏 |
2006 |
Electrical resistivity of Ti–Ni binary and Ti–Ni–X (X = Fe, Cu) ternary shape memory alloys
|
Wu, S.K.; Lin, H.C.; Lin, T.Y.; Wu, S.K.; Lin, H.C.; Lin, T.Y.; WuSK; LinHC |
| 國立臺灣大學 |
2006 |
Electrical resistivity of Ti–Ni binary and Ti–Ni–X (X = Fe, Cu) ternary shape memory alloys
|
Wu, S.K.; Lin, H.C.; Lin, T.Y. |
Showing items 374951-374975 of 2307912 (92317 Page(s) Totally)
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