| 大葉大學 |
2002-12 |
ETBE與TAME對甲基第三丁基醚分解菌之抑制效應研究
|
洪士賢;陳政遠;呂珊茹 |
| 淡江大學 |
2000-01-09 |
ETC using IR technology in Taiwan
|
張堂賢; Chang, Tang-hsien |
| 國立臺灣大學 |
2000-01 |
ETC Using IR Technology in Taiwan
|
Chang, Tang-Hsien |
| 國立臺灣大學 |
2004 |
ETC 區段收費改為里程收費之最適前端系統佈置機制研究
|
林志憲; Lin, Shih-Hsien |
| 大葉大學 |
2001 |
Etch Film and Pit Structure of AA1050 Aluminum Plates Electrograined in Nitric and Hydrochloric Acids, and Hydrochloric Acids
|
Fu, H. M. |
| 臺大學術典藏 |
2018-09-10T04:51:55Z |
ETCH Rate and Thickness Measurements of Layered GaAs, AlAs and AlGaAs Structures Using a Laser Reflectance Technique
|
Grober, Louise H;Hong, M;Grober, RD;Mannaerts, JP;Freund, RS; Grober, Louise H; Hong, M; Grober, RD; Mannaerts, JP; Freund, RS; MINGHWEI HONG |
| 國立臺灣科技大學 |
2020 |
Etch-stop process for precisely controlling the vertical cavity length of GaN-based devices
|
Liu, Y.-Y.;Wu, T.-C.;Yeh, P.S. |
| 中國醫藥大學 |
2009-06-28 |
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography
|
陳建良(Jian-Lian Chen)* |
| 中國醫藥大學 |
|
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography.
|
陳建良(Jian-Lian Chen)* |
| 中國醫藥大學 |
2009-12 |
Etched succinate-functionalized silica hydride stationary phase for open tubular capillary electrochromatography.
|
陳建良(Jian-Lian Chen)* |
| 國立彰化師範大學 |
1985-01 |
Etched-coupled cavity InGaAsP/InP lasers
|
Chen, Kuo-Liang; Wang, Shyh |
| 國立中山大學 |
2000 |
Etching Characteristics and Mechanism of Ba0.7Sr0.3TiO3 Thin Films in an Inductively Coupled Plasma
|
D.S. Wuu; F.C. Liao; N.H. Kuo; R.H. Horng; M.K. Lee |
| 中原大學 |
2000 |
Etching Characteristics of Organic Low-k Dielectrics in the Helicon-wave Plasma Etcher for 0.15 μm Damascene Architecture.
|
J.M. Shieh;T.C. Wei;C.H. Liu;S.C. Suen;B.T. Dai |
| 臺大學術典藏 |
2018-09-10T07:09:06Z |
Etching Characteristics of SiNx Films for DUV Lithography Applications
|
L. A. Wang; LON A. WANG; H. L. Chen |
| 國立交通大學 |
2014-12-08T15:40:39Z |
Etching damages on AlGaN, GaN and InGaN caused by hybrid inductively coupled plasma etch and photoenhanced chemical wet etch by Schottky contact characterizations
|
Fang, CY; Huang, WJ; Chang, EY; Lin, CF; Feng, MS |
| 國立交通大學 |
2014-12-16T06:14:21Z |
Etching method for nitride semiconductor
|
Lee; Wei-I; Huang; Hsin-Hsiung; Zeng; Hung-Yu |
| 國立交通大學 |
2014-12-16T06:15:50Z |
Etching method for nitride semiconductor
|
Lee, Wei-I; Huang, Hsin-Hsiung; Zeng, Hung-Yu |
| 國立交通大學 |
2014-12-08T15:07:16Z |
Etching of GaN by microwave plasma of hydrogen
|
Tiwari, Rajanish N.; Chang, Li |
| 國立中山大學 |
2001 |
Etching of platinum thin films in an inductively coupled plasma
|
D.S. Wuu; H.H. Kuo; F.C. Liao; R.H. Horng; M.K. Lee |
| 國立交通大學 |
2014-12-08T15:02:34Z |
Etching of rf magnetron-sputtered indium tin oxide films
|
Chiou, BS; Lee, JH |
| 臺大學術典藏 |
2020-01-06T03:08:39Z |
Etching of ruthenium coatings in O 2- and Cl 2- containing plasmas
|
Hsu, C.C.; Coburn, J.W.; Graves, D.B.; JERRY CHENG-CHE HSU |
| 國立臺灣大學 |
1994 |
Etching of YBa2Cu3Oy surface by scanning tunneling microscope
|
Chen, S.; Wang, L.M.; Yang, H.C.; Horng, H.E. |
| 中原大學 |
2003-05-20 |
Etching process
|
Chen Bi-Ling;Jeng Erik S.;Liu Hao-Chieh |
| 臺大學術典藏 |
2018-09-10T05:21:42Z |
Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures
|
KUANG-CHONG WU; Esashi, M.; Wu, K.-C.; Lee, C.-K.; Kawai, Y.; Shih, J.-J.; Kanamori, Y.; Wang, Y.-F.; KUANG-CHONG WU;Esashi, M.;Wu, K.-C.;Lee, C.-K.;Kawai, Y.;Shih, J.-J.;Kanamori, Y.;Wang, Y.-F.;Chang, C.; Chang, C. |
| 臺大學術典藏 |
2020-04-28T07:12:30Z |
Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures
|
Chang, C.; Wang, Y.-F.; Kanamori, Y.; Shih, J.-J.; Kawai, Y.; Lee, C.-K.; Wu, K.-C.; Esashi, M.; CHIH-KUNG LEE |
