| 國立臺灣科技大學 |
2013 |
Failure analysis of a highway dip slope slide
|
Lee, W.F.;Liao, H.J.;Chang, M.H.;Wang, C.W.;Chi, S.Y.;Lin, C.C. |
| 國立成功大學 |
2013-02 |
Failure Analysis of a Highway Dip Slope Slide
|
Lee, W. F.; Liao, H. J.; Chang, M. H.; Wang, C. W.; Chi, S. Y.; Lin, C. C. |
| 國立交通大學 |
2017-04-21T06:49:06Z |
Failure analysis of a MEMS micro-injector printing head
|
Lee, In-Yao; Hsu, Tsung-Ping; Wang, Wai W.; Chiu, Yi; Tang, Hua-Kun; Tseng, Fan-Chung; Lee, Kelvin |
| 中華大學 |
2008 |
Failure Analysis of a Reinforced Soil Slope
|
吳淵洵; Wu, Jason Y. |
| 國立高雄第一科技大學 |
2008.06 |
Failure analysis of a silane gas cylinder valve: A case study
|
Peng, Deng-Jr;Chang, Yo-Yu;Wu, Hong-Chun;Tsaur, Charng-Cheng;Chen, Jenq-Renn |
| 義守大學 |
2002-12 |
Failure analysis of BGA package by a TDR approach
|
Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu |
| 義守大學 |
2012-10 |
Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging
|
Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu |
| 義守大學 |
2014-02 |
Failure analysis of EOS-induced damage at final electrical testing
|
Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Failure analysis of ESD damage in a high-voltage driver IC and the effective ESD protection solution
|
Ker, MD; Peng, JJ; Jiang, HC |
| 國立成功大學 |
2015-12-15 |
Failure analysis of fiber-reinforced composite laminates subjected to biaxial loads
|
Hu, Hsuan-Teh; Lin, Wen-Pin; Tu, Fang-Tai |
| 國立交通大學 |
2017-04-21T06:48:54Z |
Failure Analysis of Gate-all-around Nanowire Field Effect Transistor Under TLP Test
|
Zhang, Guoyan; Dong, Aihua; Liu, Nie; Tian, Rui; Yang, Xuejiao; Liu, Zhiwei; Lee, Kohui; Lin, Horng-Chih; Liou, Juin J.; Wang Yuxin |
| 國立成功大學 |
2012-03 |
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
|
Chang, Hung-Jen; Zhan, Chau-Jie; Chang, Tao-Chih; Chou, Jung-Hua |
| 國立高雄應用科技大學 |
2008 |
Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films
|
Lin, Chao-Ming; Lin, Tzu-Chao; Fang, Te-Hua; Chao, Kuo-Sheng |
| 亞洲大學 |
2012-09 |
Failure Analysis of Power MOSFETs based on Multi-finger Configuration under Unclamped Inductive Switching (UIS) Stress Condition
|
楊紹明;Yang, Shao-Ming;蔡宗叡;Tsai, Jung-Ruey;許健;Sheu, Gene |
| 亞洲大學 |
2012-09 |
Failure Analysis of Power MOSFETs based on Multifinger Configuration under Unclamped Inductive
|
楊紹明;Yang, Shao-Ming;許健;Sheu, Gene |
| 國立勤益科技大學 |
2008-02 |
Failure Analysis of Reverse Shaft in the Transmission System of All-Terrain Vehicles
|
Lin, Chun-Yuan;Hung, Jui-Pin;Hsu, Tze-Chi |
| 國立交通大學 |
2014-12-08T15:21:42Z |
Failure Analysis of Small Composite Sandwich Turbine Blade Subjected to Extreme Wind Load
|
Chen, C. P.; Kam, T. Y. |
| 國立臺灣科技大學 |
2012 |
Failure analysis of the oil transport spiral welded pipe
|
Lin, M.-B.;Gao, K.;Wang, C.-J.;Volinsky, A.A. |
| 國立臺灣科技大學 |
2013 |
Failure analysis of wind turbine blade under critical wind loads
|
Chou, J.-S.;Chiu, C.-K.;Huang, I.-K.;Chi, K.-N. |
| 國立交通大學 |
2014-12-08T15:28:41Z |
Failure Analysis on Gate-Driven ESD Clamp Circuit after TLP Stresses of Different Voltage Steps in a 16-V CMOS Process
|
Dai, Chia-Tsen; Chiu, Po-Yen; Ker, Ming-Dou; Tsai, Fu-Yi; Peng, Yan-Hua; Tsai, Chia-Ku |
| 國立交通大學 |
2020-10-05T02:00:30Z |
Failure Analysis on TiAl Metallization Process for Ohmic Contact on 4H-SiC pMOSFET
|
Hung, Chia-Lung; Cheng, Jung-Chien; Tsui, Bing-Yue |
| 臺大學術典藏 |
1990 |
Failure Analysis:Principles and Case Studies
|
單秋成; 單秋成; Shin, Chow-Ching |
| 國立臺灣大學 |
1990 |
Failure Analysis:Principles and Case Studies
|
單秋成; Shin, Chow-Ching |
| 國立交通大學 |
2014-12-08T15:06:37Z |
Failure and degradation mechanisms of high-power white light emitting diodes
|
Yang, Shih-Chun; Lin, Pang; Wang, Chien-Ping; Huang, Sheng Bang; Chen, Chiu-Ling; Chiang, Pei-Fang; Lee, An-Tse; Chu, Mu-Tao |
| 國立臺灣大學 |
1990 |
Failure and Stability of Rock Slopes Alone the Central Cross-Island Highway, Taiwan
|
洪如江; Lin, Chii-Wen; Hung, Ju-Jiang; Lin, Chii-Wen |
