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Institution Date Title Author
南台科技大學 1999-04 Failure Criteria for Multiply Flawed Anisotropic Materials 吳宗霖; Wu, Tsung-Lin; Huang, J. H
臺大學術典藏 2018-09-10T03:24:21Z Failure criteria of dentin-resin adhesion - a mixed mode fracture mechanics approach CHUN-PIN LIN; JUNG-HO CHENG; Jung-Ho Cheng;Chun-Pin Lin;Douglas, W.H.;Versluis, A.;Cheng, J.-H.;Lin, C.-P.; Lin, C.-P.; Cheng, J.-H.; Versluis, A.; Douglas, W.H.
國立臺灣大學 2000 Failure criteria of dentin-resin adhesion - A mixed mode fracture mechanics approach Lin, C.P.; Cheng, J.H.; Versluis, A.; Douglas, W.H.
臺大學術典藏 2021-07-26T06:53:24Z Failure criteria of dentin-resin adhesion - a mixed mode fracture mechanics approach CHUN-PIN LIN; Cheng J.-H.; Versluis A.; Douglas W.H.
國立臺灣大學 2007 Failure Criteria of Dentin-Resin Adhesion - The J –Integral Approach 李伯訓; 林俊彬; LEE, BOR-SHIUNN; LIN, CHUN-PIN
國立臺灣大學 2007-03 Failure criteria of dentin-resin adhesion - The J-integral approach Lee, B. S.; Chiang, Y. C.; Hung, W. C.; Cheng, J. H.; Lin, C. P.
臺大學術典藏 2021-07-05T03:41:26Z Failure criteria of dentin-resin adhesion - The J-integral approach BOR-SHIUNN LEE; Chiang Y.-C.; Hung W.-C.; Cheng J.-H.; Lin C.-P.
臺大學術典藏 2021-07-07T00:51:42Z Failure criteria of dentin-resin adhesion - The J-integral approach Lee B.-S.; YU-CHIH CHIANG; Hung W.-C.; Cheng J.-H.; Lin C.-P.
臺大學術典藏 2021-07-26T06:53:15Z Failure criteria of dentin-resin adhesion - The J-integral approach Lee B.-S.; Chiang Y.-C.; Hung W.-C.; Cheng J.-H.; CHUN-PIN LIN
國立臺灣大學 2000 Failure Criteria of Dentin-Resin Adhesion?A Mixed Mode Fracture Mechanics Approach Lin, C.P.; Cheng, J.H.; Versluis, A.; Douglas, W.H.
國立臺灣大學 1998 Failure Criteria of Dentin-Resin Tensile Bond Test - a Fracture Mechanics Approach LIN, CHUN-PIN; CHEN, RUEY-SONG; LIU, CHEN -CHANG; LIAN, SHUANG-SHII; 林俊彬; 陳瑞松; 劉鎮彰; 連雙喜
臺大學術典藏 2018-09-10T06:15:24Z Failure criteria of Dentin-Resin tensile bond test - A fracture mechanics approach Lin, C.-P.;Chen, R.-S.;Liu, C.-C.;Lian, S.-S.; CHUN-PIN LIN
臺大學術典藏 2021-07-26T06:53:29Z Failure criteria of Dentin-Resin tensile bond test - A fracture mechanics approach CHUN-PIN LIN; Chen R.-S.; Liu C.-C.; Lian S.-S.
國立臺灣大學 1997 Failure Criteria of Dentin-Resin Tensile Bond Test—A Fracture Mechanics Approach Lin, Chun-Pin; Chen, Ruey-Song; Liu, Chen-Chang; Lian, Shuang-Shii
臺大學術典藏 1997 Failure Criteria of Dentin-Resin Tensile Bond Test—A Fracture Mechanics Approach Lin, Chun-Pin;Chen, Ruey-Song;Liu, Chen-Chang;Lian, Shuang-Shii; Lin, Chun-Pin; Chen, Ruey-Song; Liu, Chen-Chang; Lian, Shuang-Shii
臺大學術典藏 2007 Failure criteria of dentin–resin adhesion – The J-integral approach Lin, Chun-Pin; Hung, Wei-Chih; Cheng, Jung-Ho; Lee, Bor-Shiunn; Chiang, Yu-Chih; Lee, Bor-Shiunn; Chiang, Yu-Chih; Hung, Wei-Chih; Cheng, Jung-Ho; Lin, Chun-Pin; Lee, Bor-Shiunn;Chiang, Yu-Chih;Hung, Wei-Chih;Cheng, Jung-Ho;Lin, Chun-Pin
國立臺灣大學 2007 Failure criteria of dentin–resin adhesion – The J-integral approach Lee, Bor-Shiunn; Chiang, Yu-Chih; Hung, Wei-Chih; Cheng, Jung-Ho; Lin, Chun-Pin
臺大學術典藏 2020-02-26T01:36:42Z Failure criterion of collagen fiber: Viscoelastic behavior simulated by using load control data Jaw-Lin WangWang, J.L.;Parnianpour, M.;Shirazi-Adl, A.;Engin, A.E.; Wang, J.L.; Parnianpour, M.; Shirazi-Adl, A.; Engin, A.E.; JAW-LIN WANG
國立臺灣大學 1997-04 Failure criterion of collagen fiber: Viscoelastic behaviors simulated by using load control data Wang, JL; Parnianpour, M; Shirazi-Adl, A; Engin, AE
臺大學術典藏 2018-09-10T03:50:22Z Failure Detection Mechanism for Distributed Object Computing Using CORBA W. C. Su; S. C. Wang; S. Y. Kuo; SY-YEN KUO
國立交通大學 2017-04-21T06:49:17Z Failure Detection Service with Low Mistake Rates for SDN Controllers Yang, Tsai-Wei; Wang, Kuochen
臺大學術典藏 2018-09-10T04:51:31Z Failure diagnosis using decision trees Chen, M.; Zheng, A.X.; Lloyd, J.; Jordan, M.I.; Brewer, E.; Chen, M.; Zheng, A.X.; Lloyd, J.; Jordan, M.I.; Brewer, E.; YEN-YANG CHEN
國立臺灣科技大學 2003 Failure diagnosis: a case study on modeling and analysis by Petri nets Sheng-Luen Chung;Chien-Chung Wu;MuDer Jeng
國立交通大學 2014-12-08T15:10:54Z Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints Chen, Hsiao-Yun; Chen, Chih; Tu, King-Ning
國立臺灣科技大學 2015 Failure investigation at a collapsed deep excavation in very sensitive organic soft clay Chen, R.P.;Li, Z.C.;Chen, Y.M.;Ou, C.Y.;Hu, Q.;Rao, M.
國立臺灣海洋大學 2013 Failure Investigation of a Drilled Shaft Stabilized Slope Liao, J.C;Lin, S.S;Yang, S.D
中華大學 2006 Failure Investigation of a Foamed Asphalt Highway Projects 邱垂德; Chiu, Chui-Te
中國醫藥大學 2009-10-17 Failure is the mother of success! Risk factors associated with surgical failures in urogynecology 陳慧毅(Huey-Yi Chen)
國立成功大學 2016-11 Failure life estimation of sharp-notched circular tubes with different notch depths under cyclic bending Lee, Kuo-Long; Chang, Kao-Hua; Pan, Wen-Fung
國立交通大學 2014-12-08T15:11:01Z Failure mechanism and bearing capacity of shallow foundation on poorly cemented sandstone Chang, J. -C.; Liao, J. -J.; Pan, Y. -W.
國立中山大學 1999-12 Failure Mechanism and Mechanical Properties of Carbon/PEEK Composite Laminates due to Notch and Temperature Effects S.C. Chang; W.H. Lin; H.K. Kung; M.H.R. Jen
國立成功大學 2014-06-01 Failure Mechanism for GaN-Based High-Voltage Light-Emitting Diodes Chang, Shoou-Jinn; Chang, Chung-Ying; Tseng, Chun-Lung; Shen, Ching-Shing; Chen, Bing-Yang
國立交通大學 2020-03-02T03:23:30Z Failure mechanism of a mudstone slope embedded with steep anti-dip layered sandstones: case of the 2016 Yanchao catastrophic landslide in Taiwan Lin, Cheng-Han; Hung, Ching; Weng, Meng-Chia; Lin, Ming-Lang; Uzuoka, Ryosuke
國立成功大學 2019-11 Failure mechanism of a mudstone slope embedded with steep anti-dip layered sandstones: case of the 2016 Yanchao catastrophic landslide in Taiwan Lin;Cheng-Han;Hung;Ching;Weng;Meng-Chia;Lin;Ming-Lang;Uzuoka;Ryosuke
國立成功大學 2004 Failure mechanism of amorphous and crystalline Ta-N films in the Cu/Ta-N/Ta/SiO2 structure Chang, Ching-Chun; Chen, Jen-Sue; Hsu, Wu-Shiung
國立交通大學 2017-04-21T06:48:57Z Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih
南台科技大學 2006 Failure Mechanism of Electromigration (EM) in Via Sidewall for Copper Dual Damascene Interconnection Y. L.Hsu; Y. K. Fang; Y. T. Chiang; S.F. Chen; C. Y Lin.; T. H. Chou; S. H. Chang;陳世芳
國立成功大學 2006 Failure mechanism of electromigration in via sidewall for copper dual damascene interconnection Hsu, Y. L.; Fang, Yean-Kuen; Chiang, Yen-Ting; Chen, Shih-Fang; Lin, C. Y.; Chou, T. H.; Chang, S. H.
臺大學術典藏 2018-09-10T18:03:09Z Failure mechanism of hollow tree trunks due to cross-sectional flattening JIA-YANG JUANG; JIA-YANG JUANG
臺大學術典藏 2021-07-26T06:53:30Z Failure mechanisms at the human dentin-resin interface: A fracture mechanics approach CHUN-PIN LIN; Douglas W.H.
臺大學術典藏 2020-01-13T08:20:14Z Failure mechanisms in thick composites under compressive loading Daniel, I.M.; Hsiao, H.-M.; Wooh, S.-C.; HAO-MING HSIAO
國立臺灣科技大學 2012 Failure mechanisms in wind turbine blade surface under critical wind loads Chou, J.-S.;Huang, I.-K.
國立成功大學 2017 Failure mechanisms of steep-faced geosynthetic-reinforced retaining walls subjected to toe scouring Huang;Ching-Chuan
國立臺灣科技大學 2017 Failure mode analysis of induction motor model Hsiao, C.-H.;Liu, M.-K.
大葉大學 2008-07-20 Failure mode analysis of small composite wind turbine blades Hroung, Wu Jia;Yan, Kam Tai;Min, Lai Feng;Chung, Tseng Yu
義守大學 2015-10 Failure mode investigation of die pick process with high speed camera and numerical analysis De-Shin Liu;Chieh-Jung Lu;Cho-Liang Chung
國立臺灣大學 2000 Failure Modeling and Process Monitoring for Flexible Manufacturing Systems Using Colored Timed Petri Nets Kuo, C.H.; Huang, H.P.
臺大學術典藏 2020-01-13T08:18:35Z Failure modeling and process monitoring for flexible manufacturing systems using colored timed petri nets Kuo, C.-H.; Huang, H.-P.; HAN-PANG HUANG
臺大學術典藏 2022-05-24T06:14:27Z Failure modeling and process monitoring for flexible manufacturing systems using colored timed petri nets Kuo C.-H.;Huang H.-P.; Kuo C.-H.; Huang H.-P.; CHUNG-HSIEN KUO
國立成功大學 2012-05 Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology Horng, Ray-Hua; Lin, Re-Ching; Chiang, Yi-Chen; Chuang, Bing-Han; Hu, Hung-Lieh; Hsu, Chen-Peng

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