國立交通大學 |
2014-12-08T15:06:28Z |
INTERFACIAL LAYER THEORY OF THE SCHOTTKY-BARRIER DIODES
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WU, CY |
臺大學術典藏 |
2018-09-10T09:22:34Z |
Interfacial layer-free ZrO2 on Ge with 0.39-nm EOT, κ?43, ?2×10-3 A/cm2 gate leakage, SS =85 mV/dec, Ion/Ioff =6×105, and high strain response
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Chang, H.-C.; Chen, Y.-T.; Wong, I.-H.; Lan, H.-S.; Luo, S.-J.; Lin, J.-Y.; Tseng, Y.-J.; Liu, C.W.; Hu, C.; Yang, F.-L.; Lin, C.-M.; CHEE-WEE LIU et al. |
國立交通大學 |
2014-12-08T15:06:24Z |
INTERFACIAL LAYER-THERMIONIC-DIFFUSION THEORY FOR THE SCHOTTKY-BARRIER DIODE
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WU, CY |
臺大學術典藏 |
2021-12-10T08:36:46Z |
Interfacial Layering and Screening Behavior of Glyme-Based Lithium Electrolytes
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Nojabaee, M; Cheng, HW; Valtiner, M; Popovic, J; Maier, J; HSIU-WEI CHENG |
國立成功大學 |
2021 |
Interfacial magnetic coupling in Co/antiferromagnetic van der Waals compound FePS3
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Dhanarajgopal, A.;Chang, P.-C.;Liu, S.-Y.;Chuang, T.-H.;Wei, D.-H.;Kuo, C.-C.;Kuo, C.-N.;Lue, C.S.;Lin, W.-C. |
臺大學術典藏 |
2020-03-31T08:24:54Z |
Interfacial magnetic coupling in hetero-structure of Fe/double-perovskite NdBaMn2O6 single crystal
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Lin, W. C.; Tsai, C. L.; Ogawa, K.; Yamada, S.; Gandhi, A. C.; Lin, J. G. |
元智大學 |
2003-11 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
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楊鴻銘; 吳和生 |
元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
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楊鴻銘; 吳和生 |
元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
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楊鴻銘; 吳和生 |
國立交通大學 |
2014-12-08T15:42:26Z |
Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
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Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC |
臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Lin, Hsiu-Jen; Chuang, Tung-Han |
臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
國立交通大學 |
2014-12-08T15:37:18Z |
Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures
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Chen, SY; Hsiao, CS; Hsu, JJ |
元智大學 |
Sep-18 |
Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects
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Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho |
國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
國立成功大學 |
2011-04-29 |
Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates
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Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu |
國立中山大學 |
2002 |
Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package
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Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung |
元智大學 |
Aug-16 |
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films
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Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho |
國立聯合大學 |
2008 |
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
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Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang and Ming-Kann Liang |
臺大學術典藏 |
2018-09-10T03:44:28Z |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
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Wu, S.K.; Chen, J.Z.; Wu, Y.J.; Wang, J.Y.; Yu, M.N.; Chen, F.R.; Kai, J.J.; SHYI-KAAN WU |
國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
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Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J. Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on 100 Si
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Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J .Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
國立臺灣科技大學 |
2013 |
Interfacial modification of the working electrode of dye-sensitized solar cells to improve the charge transport properties
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Wu, K.-W.;Tedla, A.;Mu, Y.-T.;Tai, Y. |