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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
元智大學 2006-09 Integration of micro array sensors in the MEA of a fuel cell 李其源; 李碩仁; 吳冠緯; 李諭銘
元智大學 2008-03 Integration of micro array sensors in the MEA on diagnosis of micro fuel cells 李其源; 李碩仁; Wu, G.-W
元智大學 2007-01 Integration of micro array sensors in the MEA on diagnosis of micro fuel cells 李其源; 李碩仁; 吳冠緯
元智大學 2009-01 Integration of micro flow sensor and flexible substrate as GDL in micro fuel cell 李其源; 李碩仁; Yu-Ming Lee; Kuan-Yu Chu
元智大學 2009-01 Integration of micro flow sensor and flexible substrate as GDL in micro fuel cell 李其源; 李碩仁; Yu-Ming Lee; Kuan-Yu Chu
元智大學 2008-03 Integration of micro temperature sensor and heater in a stainless steel-based micro reformer 李其源; 李碩仁; Dai, C.-L.; Wu, C.-H.; Ger, M.-D
元智大學 2007-01 Integration of micro temperature sensor and heater in a stainless steel-based micro reformer 李其源; 李碩仁; 吳錦華; 葛明德
元智大學 2009-01 Integration of micro temperature sensor and metal foil as gas diffusion layer for micro fuel cell 李其源; 李碩仁; Yuh-Chung Hu; Chen-Hen Lin; Yu-Ming Lee; Wei-Yuan Fan
元智大學 2009-01 Integration of micro temperature sensor and metal foil as gas diffusion layer for micro fuel cell 李其源; 李碩仁; Yuh-Chung Hu; Chen-Hen Lin; Yu-Ming Lee; Wei-Yuan Fan
臺大學術典藏 2007 Integration of Micro-optics with Display Devices and Systems Lin, Hoang-Yan; Lin, Hoang-Yan
國立臺灣大學 2007 Integration of Micro-optics with Display Devices and Systems Lin, Hoang-Yan
國立成功大學 2023 Integration of microalgae cultivation and anaerobic co-digestion with dairy wastewater to enhance bioenergy and biochemicals production Kusmayadi, A.;Huang, C.-Y.;Kit, Leong Y.;Lu, P.-H.;Yen, H.-W.;Lee, D.-J.;Chang, J.-S.
國立成功大學 2023 Integration of microbial treatment for advanced biological treatment of wastewater Chandran, R.R.R.;Chowdhury, Z.Z.;Rana, M.;Ali, Ali A.E.;Rafique, Rafique R.F.;Rahaman, M.;Viswanathan, K.
元智大學 2008-10 Integration of microsensor and stainless steel foil as gas diffusion layer in micro fuel cell 李其源; 李碩仁; Yu-Ming Lee; Chien-Heng Lin; Wei-Jung Hsieh
國立交通大學 2019-04-02T06:00:50Z Integration of microwave-annealed oxidation on germanium metal-oxide-semiconductor devices Hsu, Chung-Chun; Chi, Wei-Chun; Tsai, Yi-He; Tsai, Ming-Li; Wang, Shin-Yuan; Chou, Chen-Han; Zhang, Jun Lin; Luo, Guang-Li; Chien, Chao-Hsin
亞洲大學 2012 Integration of Mind Map, QFD and TRIZ to Festivals Internationalization─A Case of Dragon Boat Races Yang, Lu Ting
亞洲大學 2012 Integration of Mind Map, QFD and TRIZ to Project Adventure Equipment Improvement-A Case of Rock Climbing Equipment Pan, Yu-Zhen
南亞技術學院 2016-10-01 Integration of Mobile AR Technology in Performance Assessment Chao, Kuo-Hung;Chang, Kuo-En;Lan, Chung-Hsien;Kinshuk;Sung, Yao-Ting
國立暨南國際大學 2001 Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process 劉繼文?; Liu, CW
國立暨南國際大學 2001 Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process 王英郎?; Wang, YL
國立交通大學 2014-12-08T15:43:16Z Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process Lan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG
國立成功大學 2001-11 Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process Lan, J. K.; Wang, Ying-Lang; Lo, Kuang-Yao; Liu, Chuan-Pu; Liu, C. W.; Wang, JK; Cheng, Y. L.; Chau, C. G.
臺大學術典藏 2018-09-10T15:22:50Z Integration of Modified Inverse Observation Model and Multiple Hypothesis Tracking for Detecting and Tracking Humans Chang, F.;Lian, F.;Chou, C.; Chang, F.; Lian, F.; Chou, C.; FENG-LI LIAN
國立交通大學 2014-12-08T15:01:30Z Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement Wang, YL; Tseng, WT; Feng, MS
國立交通大學 2019-04-02T05:58:48Z Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement Wang, YL; Tseng, WT; Feng, MS

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