| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
|
Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
|
Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立交通大學 |
2020-02-02T23:54:41Z |
Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites
|
Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng |
| 國立交通大學 |
2014-12-08T15:45:57Z |
Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting
|
Lin, KF; Lin, CC |
| 國立交通大學 |
2014-12-08T15:47:27Z |
Interfacial reactions between zirconia and titanium
|
Lin, KF; Lin, CC |
| 國立成功大學 |
2014-01 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
|
Lin, Shih-kang; Cho, Cheng-liang; Chang, Hao-miao |
| 國立成功大學 |
2013-10-15 |
Interfacial reactions in Sn-20In-2.8Ag/Cu couples
|
Lin, Shih-kang; Hsu, Che-wei; Chen, Sinn-wen; Hsu, Chia-ming |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
|
Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples
|
Yen, Yen Y.-W;Lin, C.-Y;Hermana, G.N;Chen, P.-Y;Wu, Y.-P. |
| 中原大學 |
2005 |
Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-rich Corner
|
Chih-chi Chen;Sinn-wen Chen;Ching-ya Kao; |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2019 |
Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
|
Tseng, Tseng T.-H.;Yang, C.-H.;Chiang, J.-Y.;Huang, J.-J.;Chen, Chen C.-H.;Lin, S.-K.;Wang, C.-M.;Wu, A.T. |
| 國立交通大學 |
2014-12-08T15:46:21Z |
Interfacial reactions of Co/Si0.76Ge0.24 and Co(Si0.76Ge0.24)/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Luo, JS; Hang, YL; Lin, WT; Chang, CY; Shih, PS |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of high-Bi alloys on various substrates
|
Wang, J.-Y.;Chen, C.-M.;Yen, Y.-W. |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:48:54Z |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC |
| 國立成功大學 |
1998-07 |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Tsai, W. C. |
| 國立交通大學 |
2014-12-08T15:45:14Z |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2000-06 |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates
|
Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C. |
| 國立交通大學 |
2014-12-08T15:48:43Z |
Interfacial reactions of Pd/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Chen, DR; Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2008-02-25 |
Interfacial reactions of Pt-based Schottky contacts on InGaP
|
Chu, L. H.; Chang, Edward Yi; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, Ching-Ting |
| 國立交通大學 |
2014-12-08T15:12:34Z |
Interfacial reactions of Pt-based Schottky contacts on nGaP
|
Chu, L. H.; Chang, E. Y.; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, C. T. |
| 國立臺灣科技大學 |
2008 |
Interfacial Reactions of Pure Sn and Sn-3.0Ag-0.5Cu Lead-free Solders with the Fe-42Ni Substrate
|
Yu-Ping Hsieh;Wei-Kai Liou;Yee-Wen Yen |
| 國立臺灣科技大學 |
2010 |
Interfacial reactions of pure Sn, Sn-3.0Ag-0.5Cu and Sn-9.0Zn lead-free solders with the Fe-42Ni substrate
|
Hsieh Y.-P.; Jao C.-C.; Yen Y.-W. |
| 國立臺灣大學 |
2004-12 |
Interfacial Reactions of r.f-Sputtered TiNi Thin Film on (100) Silicon with SiN Diffusion-Barrier
|
Wu, S.K.; Su, J.J.; Wang, J.Y. |
| 國立臺灣大學 |
2004 |
Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier
|
Wu, S.K.; Su, J.J.; Wang, J.Y. |
| 臺大學術典藏 |
2018-09-10T04:48:31Z |
Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier
|
SHYI-KAAN WU;Wang, J.Y.;Su, J.J.;Wu, S.K.;SHYI-KAAN WU; Wu, S.K.; Su, J.J.; Wang, J.Y.; SHYI-KAAN WU |
| 國立東華大學 |
2004 |
Interfacial Reactions of rf-Sputtered TiNi Thin Films on (100) Silicon with SiN Diffusion-Barrier
|
Wang,Jian-Yih; Wu,S. K.; Su,J. J. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates
|
Yen, Y.-W.;Hsieh, Y.-P.;Jao, C.-C.;Chiu, C.-W.;Li, Y.-S. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn lead-free solders with the Au/Ni/SUS 304 substrate
|
Chen K.-D.; Chen H.; Yen Y.-W. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate
|
Yen, Y.-W.;Syu, R.-S.;Chen, C.-M.;Jao, C.-C.;Chen, G.-D. |
| 國立臺灣科技大學 |
2010 |
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multi layer Substrate
|
Yen, Y.W.;Liaw, D.W.;Chen, K.D.;Chen, H. |
| 國立臺灣科技大學 |
2009 |
Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates
|
Liou, W.K.;Yen, Y.W.;Jao, C.C. |
| 淡江大學 |
2023-11-17 |
Interfacial Reactions of Sn52In on ENEPIG Substrates
|
Chang, K.C.;Lin, S.T.;Wang, Y.W. |
| 國立交通大學 |
2014-12-08T15:01:52Z |
Interfacial reactions of the Co/Si1-xGex system
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC; Wang, SJ |
| 國立成功大學 |
2001 |
Interfacial reactions of Ti/Cu/(100)Si
|
Yeh, M. H.; Lin, Wen-Tai |
| 國立交通大學 |
2014-12-08T15:04:34Z |
INTERFACIAL REACTIONS OF TITANIUM THIN-FILMS ON ION-IMPLANTED (001) SI
|
LIAUH, HR; CHEN, MC; CHEN, JF; CHEN, LJ; LUR, W; CHU, CH |
| 國立聯合大學 |
2010 |
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
|
Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK |
| 國立臺灣大學 |
1987 |
Interfacial Resistance in Exothermic Gas Absorption with an Instantaneous Irreversible Reaction
|
張慶源; 黃炯昌; Chang, Ching-Yuan; Hwang, Chung-Chun |
| 國立臺灣大學 |
1988 |
Interfacial Resistance in Exothermic Gas Absorption with an Instantaneous Irreversible Reaction
|
張慶源; 黃炯昌; Chang, Ching-Yuan; Hwang, Chung-Chun |
| 國立臺灣大學 |
1988 |
Interfacial resistance in exothermic gas absorption with chemical reaction
|
Chang, Ching-Yuan; Hwang, Dong-Chi'r |
| 國立臺灣大學 |
1987 |
Interfacial Resistance in Exothermic Gas Absorption with Chemical Reaction
|
張慶源; 黃炯昌; Chang, Ching-Yuan; Hwang, Chung-Chun |
| 國立臺灣科技大學 |
2002 |
Interfacial Segregation of Ti in the Brazing of Diamond Grits onto a Steel Substrate Using a Cu-Sn-Ti Brazing Alloy
|
Wen-Chung Li;Cheng Liang;Shun-Tian Lin |
| 臺大學術典藏 |
2018-09-10T05:56:16Z |
Interfacial self-cleaning in atomic layer deposition of HfO 2 gate dielectric on In 0.15 Ga 0.85 As
|
Chang, CH; Chiou, YK; Chang, YC; Lee, KY; Lin, TD; Wu, TB; Hong, M; Kwo, J; MINGHWEI HONG |
