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Showing items 520841-520850 of 2348719 (234872 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
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Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
Showing items 520841-520850 of 2348719 (234872 Page(s) Totally)
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