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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立臺灣科技大學 2014 Package design: Colour harmony and consumer expectations Wei, S.-T.;Ou, L.-C.;Luo, M.R.;Hutchings, J.B.
國立中山大學 2003-12-06 Package Implementation: A Study of Data and Output Misfit Identification Jen-Her Wu;Chi-Cheng Wu;Shin-Shing Shin
淡江大學 2018-10-04 Package mTEXO for testing the presence of outliers in exponential samples Lin, Chien-Tai;Lee, Ying-Chen;Balakrishnan, Narayanaswamy
淡江大學 2018-07-28 Package mTEXO for testing the presence of outliers in exponential samples Lin, C. T.;Lee, Y. C.;Balakrishnan, N.
淡江大學 2018-10-04 Package mTEXO for testing the presence of outliers in exponential samples. Chien-Tai Lin, Ying Chen Lee, and N. Balakrishnan
國立交通大學 2017-04-21T06:49:40Z Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學 2014-12-08T15:31:26Z Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學 2015-12-04T07:03:11Z PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu
國立交通大學 2017-02-09 PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin
國立臺灣科技大學 2020 Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity Su, J.-C.;Huang, S.-B.
義守大學 2007-02 Package-induced cross-coupling effect on amplifier harmonic suppression Han-Jan Chen;Tsung-Hui Huang;Chin-Sheng Chang;Lih-Shan Chen;Jui-Hong Horng;Yeong-Her Wang;Mau-Phon Houng
國立成功大學 2007-02 Package-induced cross-coupling effect on amplifier harmonic suppression Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon
國立成功大學 2016-08-03 Package-on-Package封裝體之熱傳研究 周景弘; Chou, Ching-Hung
國立成功大學 2016-07-08 Package-on-Package封裝體之熱傳研究 周景弘; Chou, Ching-Hung
臺大學術典藏 2018-09-10T04:55:28Z Package-strain-enhanced device and circuit performance Maikap, S.;Liao, M.H.;Yuan, F.;Lee, M.H.;Huang, C.-F.;Chang, S.T.;Liu, C.W.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.; CHEE-WEE LIU
臺大學術典藏 2019-03-11T08:00:57Z Package-strain-enhanced device and circuit performance Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.
臺大學術典藏 2018-09-10T07:42:41Z Packaged Symmetric/Asymmetric Corrugated Long Period Fiber Gratings for Refractive Index Sensing Applications Chih-Yu Huang,;Wen-Lin Chan,;Shih-Min Chuo,;Jer-Haur Chang,;Li-Lun Chen,;Lon A. Wang,; Chih-Yu Huang,; Wen-Lin Chan,; Shih-Min Chuo,; Jer-Haur Chang,; Li-Lun Chen,; Lon A. Wang,; LON A. WANG
國立成功大學 2003-05 Packaging a fiber Bragg grating with metal coating for an athermal design Lo, Yu-Lung; Kuo, Chih-Ping
國立成功大學 2002-02 Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device Lo, Yu-Lung; Kuo, Chih-Ping
南台科技大學 2003 Packaging design for e-commerce: Identifyingnew challenges and opportunities for online packaging 黃國禮; HUANG, K.L.;RUST, C.;PRESS, M.
義守大學 2004-03 Packaging Design for Implantable Microstimulator Chi-Chan Hung;Cho-Liang Chung;Gin-Shu Young;Kang-Ping Lin;Jia-Jin Chen; 鍾卓良
國立交通大學 2019-04-02T06:04:52Z Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi
國立中山大學 2009-05 Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立中山大學 2009-06 Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立臺灣科技大學 2014 Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y.

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