| 臺大學術典藏 |
2019-03-11T08:00:57Z |
Package-strain-enhanced device and circuit performance
|
Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W. |
| 臺大學術典藏 |
2018-09-10T07:42:41Z |
Packaged Symmetric/Asymmetric Corrugated Long Period Fiber Gratings for Refractive Index Sensing Applications
|
Chih-Yu Huang,;Wen-Lin Chan,;Shih-Min Chuo,;Jer-Haur Chang,;Li-Lun Chen,;Lon A. Wang,; Chih-Yu Huang,; Wen-Lin Chan,; Shih-Min Chuo,; Jer-Haur Chang,; Li-Lun Chen,; Lon A. Wang,; LON A. WANG |
| 國立成功大學 |
2003-05 |
Packaging a fiber Bragg grating with metal coating for an athermal design
|
Lo, Yu-Lung; Kuo, Chih-Ping |
| 國立成功大學 |
2002-02 |
Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device
|
Lo, Yu-Lung; Kuo, Chih-Ping |
| 南台科技大學 |
2003 |
Packaging design for e-commerce: Identifyingnew challenges and opportunities for online packaging
|
黃國禮; HUANG, K.L.;RUST, C.;PRESS, M. |
| 義守大學 |
2004-03 |
Packaging Design for Implantable Microstimulator
|
Chi-Chan Hung;Cho-Liang Chung;Gin-Shu Young;Kang-Ping Lin;Jia-Jin Chen; 鍾卓良 |
| 國立交通大學 |
2019-04-02T06:04:52Z |
Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors
|
Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi |
| 國立中山大學 |
2009-05 |
Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond
|
F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung |
| 國立中山大學 |
2009-06 |
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond
|
F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung |
| 國立臺灣科技大學 |
2014 |
Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy
|
Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y. |
| 國立臺灣大學 |
2005 |
Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications
|
Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L. |
| 國立臺灣大學 |
2005-02 |
Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications
|
Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L. |
| 臺大學術典藏 |
2005 |
Packaging methods of fiber-Bragg grating sensors in civil structure applications
|
Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.; Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A. |
| 國立臺灣大學 |
2005 |
Packaging methods of fiber-Bragg grating sensors in civil structure applications
|
Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A. |
| 臺大學術典藏 |
2018-09-10T05:29:04Z |
Packaging methods of fiber-Bragg grating sensors in civil structure applications
|
Y. B. Lin,; K. C. Chang,; J. C. Chern,; L. A. Wang,; LON A. WANG |
| 國立臺灣大學 |
1994 |
Packaging of Hepatitis Delta Virus RNA via the RNA-Binding Domain of Hepatitis Delta Antigens: Different Roles for the Small and Large Delta Antigens
|
王學偉; 陳培哲; 李嘉哲; 吳慧琳; 陳定信; WANG, HSEI-WEI; CHEN, PEI-JER; LEE, CHA-ZE; WU, HUI-LIN; CHEN, DING-SHINN |
| 臺大學術典藏 |
2021-02-02T07:51:06Z |
Packaging of hepatitis delta virus RNA via the RNA-binding domain of hepatitis delta antigens: Different roles for the small and large delta antigens
|
Wang H.-W.; Chen P.-J.; Lee, Cha-Ze; Wu H.L.; Chen D.-S. |
| 臺大學術典藏 |
2021-07-03T03:36:19Z |
Packaging of hepatitis delta virus RNA via the RNA-binding domain of hepatitis delta antigens: Different roles for the small and large delta antigens
|
Wang H.-W.; PEI-JER CHEN; Lee C.-Z.; Wu H.L.; Chen D.-S. |
| 國立成功大學 |
2008-04 |
Packaging of microfluidic chips via interstitial bonding
|
Lu, Chunmeng; Lee, L. James; Juang, Yi-Je |
| 義守大學 |
2000 |
Packaging of non-AR coated fiber grating laser for single-longitudinal mode operation
|
Lay, T.S. ; Yaung, H.M. ; Wu, S.H. ; Chen, H.M. ; Cheng, W.H. |
| 國立成功大學 |
2021-11-1 |
Packaging of semiconductor thermoelectric energy generators with in-plane thermocouples and isolation cavities
|
Yang;S, M.;Hsu;Y, S. |
| 國立成功大學 |
2008-01 |
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
|
Mao, Chao-Yang; Chen, Rong-Sheng |
| 國立成功大學 |
2015-06 |
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls
|
Cheng, Hsin-En; Chen, Rong-Sheng; Mao, Chao-Yang |
| 淡江大學 |
2004-09 |
Packaging the international travelling exhibition: the generic space under the form of McDonaldization
|
Lai, Chia-ling |
| 國立成功大學 |
2017-07-07 |
Packaging unit for liquid sample loading devices applied in electron microscope and packaging method
|
Tseng, Shih-Wen |
