國立政治大學 |
2001 |
Process Adjustment for the thickness of thin gold films
|
楊素芬;Kao |
臺大學術典藏 |
2003 |
Process Algorithms for Resolution Improvement and Contrast Enhancement in Optical Coherence Tomography
|
Hsu, I-Jen;Sun, Chia-Wei;Lu, Chih-Wei;Yang, Chih Chung;Chiang, Chun-Ping;Lin, Chii-Wann; Hsu, I-Jen; Sun, Chia-Wei; Lu, Chih-Wei; Yang, Chih Chung; Chiang, Chun-Ping; Lin, Chii-Wann |
國立臺灣大學 |
2003 |
Process Algorithms for Resolution Improvement and Contrast Enhancement in Optical Coherence Tomography
|
Hsu, I-Jen; Sun, Chia-Wei; Lu, Chih-Wei; Yang, Chih Chung; Chiang, Chun-Ping; Lin, Chii-Wann |
國立臺灣大學 |
2003-11 |
Process algorithms for resolution improvement and contrast enhancement in optical coherence tomography
|
Hsu, I. J.; Sun, C. W.; Lu, C. W.; Yang, C. C.; Chiang, C. P.; Lin, C. W. |
臺大學術典藏 |
2003 |
Process Algorithms for Resolution Improvement and Contrast Enhancement in Optical Coherence Tomography
|
Hsu, I.-J.;Sun, C.-W.;Lu, C.-W.;Yang, C.-C.;Chiang, C.-P.;Lin, C.-W.; CHUN-PIN CHIANG |
國立臺灣大學 |
2008 |
Process alternatives for methyl acetate conversion using reactive distillation. 1. Hydrolysis
|
Lin, Yu-Der; Chen, Jun-Hong; Cheng, Jian-Kai; Huang, Hsiao-Ping; Yu, Cheng-Ching |
臺大學術典藏 |
2021-10-14T01:16:06Z |
Process Analysis and Characterization of ASNSS using Automatic On-line Measurement
|
Liang-Chia Chen; Tsing-Tshih Tsung; Ho Chang; Jen-Yan Sun; LIANG-CHIA CHEN |
淡江大學 |
2002-11-30 |
Process Analysis And Process Improvement Based On The Intrinsic And Extrinsic Exergy Destruction Concept
|
張煖; Chang, H.; Li, Z. |
臺大學術典藏 |
2019-05-17T04:56:15Z |
Process analysis on photocatalyzed dye decomposition for water treatment with TiO2-coated rotating disk reactor
|
Chang C.-Y.;Wu N.-L.; Chang C.-Y.; Wu N.-L. |
淡江大學 |
2003-10-01 |
Process analysis using the concept of intrinsic and extrinsic exergy losses
|
張煖; Chang, Hsuan; 莊尚智; Chuang, Shang-chih |
國立彰化師範大學 |
2002 |
Process Analyzer and Its Application on Medical Care
|
Yang, Wan-Shiou |
淡江大學 |
1998-05-05 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-han; 林清彬; Lin, Ching-bin; Tsai, Teng-chun; Chang, Jiin-chyuan |
淡江大學 |
1996/11/01 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-Han;Lin, Ching-Bin;Tsai, Teng-Chun;Chang, Jiin-Chyuan |
淡江大學 |
2000/06/05 |
Process and apparatus for plating copper on particulate graphite
|
Lin, Ching-Bin;Lin, Jen-Fin |
亞洲大學 |
2010-06 |
Process and Ballistic-resistant Buffer Effect of Cushion Composite Layer Made of Three-dimensional Crimped Hollow Fiber
|
林青玫;LIN, CHIN-MEI |
亞洲大學 |
2008-03 |
Process and Bullet-resistant Buffer Effect of an Elastic Cushioning Structure Made of Polyamide Non-woven Fabric and Chloroprene Rubber
|
林敬文;Lin, Ching-wen |
南台科技大學 |
2017-07 |
Process and Challenges of Realtor Transformation: The case of SINGFUJIA
|
LEE, YING-CHI; 李應吉 |
國立交通大學 |
2014-12-08T15:15:16Z |
Process and characteristics of fully silicided source/drain (FSD) thin-film transistors
|
Lin, Chia-Pin; Hsiao, Yi-Hsuan; Tsui, Bing-Yue |
國立交通大學 |
2014-12-08T15:18:05Z |
Process and characteristics of modified Schottky barrier (MSB) p-channel FinFETs
|
Tsui, BY; Lin, CP |
淡江大學 |
2005-07-24 |
Process and Content Authority: A Moral Dilemma
|
黃怡萍 |
淡江大學 |
2005-01-14 |
Process and Content Authority: A Moral Dilemma
|
黃怡萍 |
國立中山大學 |
2009 |
Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications
|
J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu |
國立中山大學 |
2009 |
Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications
|
J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu |
國立交通大學 |
2014-12-08T15:26:36Z |
Process and doping species dependence of negative-bias-temperature instability for p-channel MOSFETs
|
Lee, DY; Lin, HC; Chiang, WJ; Lu, WT; Huang, GW; Huang, TY; Wang, T |
元培科技大學 |
2008-02 |
Process and formulation characterizations of the thermal adhesion granulation (TAG) process for improving granular properties
|
林宏糧(Lin, Hong-Liang) |