|
English
|
正體中文
|
简体中文
|
Total items :2853777
|
|
Visitors :
45284496
Online Users :
1010
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"蔡新春"
Showing items 1-10 of 12 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
| 國立交通大學 |
2014-12-12T02:03:59Z |
同倫數值法解非線性系統的根及在兩點邊界值問題上之應用
|
蔡新春; CAI, XIN-CHUN; 陳福祥; CHEN, FU-XIANG |
| 中原大學 |
2009-11 |
溫度負載設計對IC封裝之無鉛銲錫的疲勞壽命分析
|
鍾文仁; 蔡新春; 劉建志 |
| 中原大學 |
2007-11 |
元素分割對Sn-Ag-Cu錫球合金之潛變行為的影響 The Influences of Element Partition on Creep Responses of Sn-Ag-Cu Solder Joints
|
鍾文仁;蔡新春;黃靜慈 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2007-11 |
Sn-Ag-Cu錫球合金之PBGA封裝體疲勞强度的比較 Comparison with the Fatigue-Strength Predictions on PBGA Packages of Sn-Ag-Cu Solder
|
鍾文仁;蔡新春;黃靜慈; Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2006-08-03 |
溫度循環負載作用之無鉛化封裝的可靠度評估
|
蔡新春; Hsin-Chun Tsai |
| 中原大學 |
2005-11 |
溫度循環參數對晶圓級封裝之無鉛銲錫的影響
|
鍾文仁;蔡新春;張秀桃 |
| 中原大學 |
2005-09 |
含鉛與無鉛錫球在FCOB封裝體上之熱－機械行為的比較
|
鍾文仁;邱建嘉;蔡新春 |
| 中原大學 |
2004 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討
|
鍾文仁;邱建嘉;蔡新春;蕭振安 |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安; Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
|
鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
Showing items 1-10 of 12 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
|
