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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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"賴成展"???jsp.browse.items-by-author.description???

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Institution Date Title Author
中原大學 2004-07-30 覆晶封裝底部填膠之流動分析 賴成展; Cheng-Chang Lai
中原大學 2002-12 覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages 鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai
中原大學 2002-12 覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages 鍾文仁;賴成展;蔡新春;陳隆泰 ;Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai

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