臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
中原大學	2004-07-30	覆晶封裝底部填膠之流動分析	賴成展; Cheng-Chang Lai
中原大學	2002-12	覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages	鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai
中原大學	2002-12	覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages	鍾文仁;賴成展;蔡新春;陳隆泰 ;Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai

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