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"陳精一"

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Institution	Date	Title	Author
中華大學	2012	Experiment and Simulation in Design of the Board-Level Drop Testing Tower Apparatus	陳精一; Chen, Ching-I
中華大學	2011	SMOOTHING FOR THE OPTIMAL SURFACE OF A 3D IMAGE MODEL OF THE HUMAN OSSICLES	陳精一; Chen, Ching-I
中華大學	2011	The Vibration Analysis of Bone Conduction for Bone-Anchored Hearing Aids: In Vivo Human Temporal Bone	陳精一; Chen, Ching-I
中華大學	2011	Influence of the Depth of Human Ear Canal on Sound Pressure Distribution	陳精一; Chen, Ching-I
中華大學	2011	The Vibration Analysis of Bone Conduction for Bone-Anchored Hearing Aids: In Vivo Human Temporal Bone	陳精一; Chen, Ching-I
中華大學	2011	The vibration analysis of bone conduction for bone anchored hearing aids:In-vivo human mastoid	陳精一; Chen, Ching-I
中華大學	2011	The dynamic characteristic of in-vivo human ossicles	陳精一; Chen, Ching-I
中華大學	2010	PARAMETER STUDY TO THE INTERPOSER STRESS ANALYSIS OF FINE PITCH 3-D STACK PACKAGE	陳精一; Chen, Ching-I
中華大學	2010	ANSYS電腦輔助工程實務分析	陳精一; Chen, Ching-I
中華大學	2009	PRACTICAL EVALUATION FOR LONG-TERM STABILITY OF THERMAL INTERFACE MATERIAL	陳精一; Chen, Ching-I
中華大學	2009	多晶矽太陽能電池正面電極網印製程參數研究	陳精一; Chen, Ching-I
中華大學	2009	人耳配戴CIC助聽器外殼耳道內剩餘空間聲場分析	陳精一; Chen, Ching-I
中華大學	2009	上板電子封裝掉落衝擊動態系統之設計	陳精一
中華大學	2008	THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS	陳精一; Chen, Ching-I
中華大學	2008	Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder	陳精一; Chen, Ching-I
中華大學	2008	運用有限元素法逆算出無鉛錫球之疲勞延展係數	陳精一; Chen, Ching-I
中華大學	2008	封裝熱應力對參雜型應變矽MOSFET之應力分析	陳精一; Chen, Ching-I
中華大學	2008	CMOS 影像感測器晶圓級晶片封裝技術之可靠度分析	陳精一; Chen, Ching-I
中華大學	2008	Experimental and Numerical Investigations on Solder Reliability for Flip-Chip BGA Packaging	陳精一; Chen, Ching-I
中華大學	2008	封裝效應對應變矽MOSFET之應力分析	陳精一; Chen, Ching-I
中華大學	2007	Finite Element Analysis of 90-nm Cu/Low-K Interconnection Interactions with Chip-Packaging Factors	陳精一; Chen, Ching-I
中華大學	2007	Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly	陳精一; Chen, Ching-I
中華大學	2007	Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability	陳精一; Chen, Ching-I
中華大學	2007	活體中耳聽小骨鏈調合力之振動特性	陳精一; Chen, Ching-I
中華大學	2006	An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding	陳精一; Chen, Ching-I

Showing items 1-25 of 47 (2 Page(s) Totally)
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