臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	2006-03	The Experimental Study for the Solder Joint Reliability of High I/O FCBGA’s with Thermal Loaded Bend Test	陳永樹; C.S. Wang; A.C. Shiah
元智大學	2004-08	The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test	陳永樹; C.S. Wang; A.C. Shiah
元智大學	2004-08	An Experimental Study of the Mounting Forces for Various Components Mounted on the PCB with Different Lead Free Solder Pastes	陳永樹; C.S. Wang; A.C. Shiah; Ken Lee

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