臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立中山大學	2009	Underfill study for large dice flip chip packages	A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	Gold stud bumps for high performance flip chip packages	W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng

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