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Institution	Date	Title	Author
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Fine pitch copper wire bonding – why now?	B.K. Appelt;A. Tseng;Y.S. Lai

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