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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T09:48:07Z |
TSV-aware analytical placement for 3-D IC designs based on a novel weighted-average wirelength model
|
Hsu, M.-K.;Balabanov, V.;Chang, Y.-W.; Hsu, M.-K.; Balabanov, V.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2018-09-10T09:48:07Z |
TSV-aware analytical placement for 3-D IC designs based on a novel weighted-average wirelength model
|
Hsu, M.-K.;Balabanov, V.;Chang, Y.-W.; Hsu, M.-K.; Balabanov, V.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2018-09-10T08:42:36Z |
TSV-aware analytical placement for 3D IC designs
|
Hsu, M.-K.;Chang, Y.-W.;Balabanov, V.; Hsu, M.-K.; Chang, Y.-W.; Balabanov, V.; YAO-WEN CHANG |
| 臺大學術典藏 |
2018-09-10T08:42:36Z |
TSV-aware analytical placement for 3D IC designs
|
Hsu, M.-K.;Chang, Y.-W.;Balabanov, V.; Hsu, M.-K.; Chang, Y.-W.; Balabanov, V.; YAO-WEN CHANG |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
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