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Showing items 31-54 of 54  (3 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2006-06-04 Experimental Analysis of Thermal Deformation Effects o?n LCD Backlight Module C.H. Chien; C.T. Tsai; Y.M. Tzeng; C.C. Hsieh; M.L. Tsai
國立東華大學 2006 Spatial dichotomy of quasiparticle dynamics in underdoped thin-film YBa2Cu3O7-δ superconductors 陳美杏; Chen, Mei-Hsin; C. W. Luo;C. C. Hsieh;Y-J Chen; P. T. Shih;M. H. Chen;K. H. Wu;J. Y. Juang;J.-Y. Lin;T. M. Uen ;Y. S. Gou
國立中山大學 2006 Nanoscale Deformation Measurement using the Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.T. Chiou; C.C. Hsieh; Y.C. Chen; T.P. Chen; M.L. Tsai; C.T. Wang
國立中山大學 2006 Stability of the warpage in a PBGA package subjected to hygro-thermal loading C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學 2006 In-Plane Microgenerator with High Energy Product Magnet P.J. Cheng; S.C. Shen; C.T. Pan; C.C. Hsieh; T.T. Wu; H.C. Liu
國立高雄第一科技大學 2005.07 A study of the geometry of microball lens arrays using the novelbatch-fabrication technique C.H.Chien, C.T.Pan;C.C.Hsieh;C.M.Yang;K.L.Sher; 謝其昌
國立中山大學 2005 Study on The Geometry of Microball Lens Array by Novel Batch-fabrication Technique C.H. Chien; C.T. Pan; C.C. Hsieh; C.M. Yang; K.L. Sher
國立高雄第一科技大學 2004.10 Magnetically-actuated bending-mode microactuators with excimer laser ablation C.T.Pan;S.C.Shen;C.C.Hsieh; 謝其昌
國立中山大學 2004-12 The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis C.H. Chien; C.T. Pan; C.M. Yang; C.C. Hsieh
國立中山大學 2004-08 Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
國立中山大學 2004-06-07 Investigations of the Mixed-mode Fracture of IC Package Interfaces C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學 2004-06-07 The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學 2004-05-16 Hygro-Thermal Buckling Of A Thin PBGA Package C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學 2004 Numerical Method to Predict and Fabricate Aspherical Micro-lens Array Using 248nm Excimer Laser Ablation C.T. Pan; S.C. Shen; C.C. Hsieh; C.H. Chien; Y.C. Chen
國立中山大學 2004 Technique of Microball Lens Formation for Efficient Optical Coupling C.T. Pan; C.H. Chien; C.C. Hsieh
國立中山大學 2004 Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學 2004 Magnetically-actuated bending-mode microactuators with excimer laser ablation C.T. Pan; S.C. Shen;C.C. Hsieh
國立中山大學 2003-06-02 Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學 2003-06 Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學 2003 Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學 2002 The Measurement of Interfacial Strength of IC Package by Moire Interferometry C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
淡江大學 2001-03 Flow Field and Particle Attachment in a Straight Pipe with a Symmetric Cavity 謝之真; C. C. Hsieh; 文浩然; H. J. Wen; 吳容銘; Wu, R. M.; 李篤中; Lee, D. J.
中國醫藥大學 1994-03 Effect of Gui-Pi-Tang (歸脾湯) on Passive Avoidance Learning in rats. (Hsieh, M.T.); (F.Y.Chueh); 蔡輝彥(H.Y. Tsai); (W.H. Peng); (C.C. Hsieh)
中國醫藥大學 1993-05 Effects of Alangium chinese on Motor Activity and the Concentration of Monoamines in rats. (Hsieh, M.T.); (F.Y.Chueh); 蔡輝彥(H.Y. Tsai); (W.H. Peng); (C.C. Hsieh)

Showing items 31-54 of 54  (3 Page(s) Totally)
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