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Showing items 31-55 of 104  (5 Page(s) Totally)
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Institution Date Title Author
國立屏東大學 2010 Joint Optimization of Energy Allocation and Routing Problems in Wireless Sensor Networks 王朱福;J.W.Ding;C.C.Lee
國立屏東大學 2010 The Optimization of Sensor Relocation in Wireless Mobile Sensor Networks 王朱福;C.F.Wang;C.C.Lee
亞洲大學 2009-09 Pernatal diagnosis of partial trisomy 14q (14q31.1->qter) and partial monosomy 5p (5p13.2->pter) associated with polyhydramnios, short limbs, micropenis and brain malformations 陳持平;Chen, Chih-Ping;Chern, Schu-Rern;F.J.Tsai;C.C.Lee;L.F.Chen;W.Wang
國立臺灣海洋大學 2009-05 An OFDM-based Underwater Acoustic Multimedia Transmission Scheme C. F. Lin;C.H. Shih;C.P. Chen;C.C. Lee;S.W. Leu;J.K. Wu;C.H. Tseng;H.S. Hung;F.S. Lu;I. A. Parinov;S.H. Chang
育達商業科技大學 2009 Reversible Data Hiding Using High-Peak Prediction Errors C.L. Liu;C.C. Lee;D.C. Lou;W. Hong;J. Chen;C.W. Shiu
國立高雄師範大學 2009 The major source and impact of phenyltin contamination of freshwater aquaculture clam Corbicula fluminea and wild gold apple snail Pomacea canaliculata 陳士賢;田倩蓉; C. C. Lee;Y. F. Jhuang;L. L. Liu;C. Y. Hsieh;Colin S. Chen;Chien-Jung Tien
國立中山大學 2009 Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學 2009 Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學 2009 Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學 2009 Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學 2009 Effect of surface roughness of silicon dies and copper heat spreaders to the thermal performance of HFCBGAs T.H. Wang;S.N. Paisner;C.C. Lee;S. Chen;Y.S. Lai
國立中山大學 2009 High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests T.H. Wang;H.Y. Chen;C.C. Lee;Y.S. Lai
國立中山大學 2009 Influence of Varied degree of Phenyl-substituted on Fluorinated Poly (arylene ether)s Conformation utilizing Flexible thin film C.C. Lee;W.Y. Huang
國立中山大學 2009 Influence of Varied degree of Phenyl-substituted on Fluorinated Poly (arylene ether)s Conformation utilizing Flexible thin film C.C. Lee;W.Y. Huang
國立中山大學 2009 Functional Properties of Varied degree of Phenyl-substituted on Fluorinated Poly(arylene ether)s utilizing Flexible thin film C.C. Lee;W.Y. Huang
國立中山大學 2009 Advanced Materials of Poly(arylene ether)s containing Fluorine atoms within Flexible Substrate C.C. Lee;W.Y. Huang
國立中山大學 2009 The Role of Conformational Transitions on the Performance of Poly(3-hexylthiophene)/Fullerene Solar Cells W.Y. Huang;C.C. Lee;T.L. Hsieh
國立中山大學 2009 Does candidates' advertising spending help winning? C.P. Chang;C.C. Lee
元智大學 2008-09 Road Sign Detection Using Eigen Color 謝君偉; Luo-Wei Tsai; Chi-Hung Chuang; Yun-Jung Tseng; Kuo-Chin Fan; C.-C. Lee
國立臺灣海洋大學 2008-09 Road Sign Detection Using Eigen Color Luo-Wei Tsai; Jun-Wei Hsieh; Chi-Hung Chuang; Yun-Jung Tseng; Kuo-Chin Fan; C.-C. Lee
育達商業科技大學 2008 Applying Mahalanobis distance into SERVQUAL analysis-a case study of hospital outpatient 李政宗;C. C. LEE;L. H. HO
國立中山大學 2008 Knowledge Management meshing with work Practices: A Case Study Exploring ASE's Knowledge Communities D.H. Tsai;C.F. Lee;C.C. Lee
國立中山大學 2008 P MR Spectroscopic Assessment of Muscle in Patients with Myasthenia Gravis befor and after Thymectomy: Initial Experience S.F. Ko; C.C. Huang; M.J. Hsieh; S.H. Ng; C.C. Lee; T.K. Lin; M.C. Chen; L. Lee
衛生福利部國家中醫藥研究所 2007 Antiplatelet autoantibodies elicited by dengue virus non-structural protein 1 cause thrombocytopenia and mortality in mice D.S.Sun; C.C.King; H.S.Huang; Y.L.Shih; C.C.Lee; W.J.Tsai; C.C.Yu; H.H.Chang
國立屏東大學 2007 Optimal Deployment for Wireless Sensor Networks Using Lifetime Expectation Estimation 王朱福;C.C.Lee;H.S.Chu

Showing items 31-55 of 104  (5 Page(s) Totally)
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