臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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机构	日期	题名	作者
臺大學術典藏	2018-09-10T09:50:40Z	Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression	C.-D. Wang;T.-L. Wu; C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T09:50:40Z	ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments	YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang
臺大學術典藏	2018-09-10T09:25:10Z	Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes	C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏	2018-09-10T09:25:10Z	A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method	YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:46:52Z	Accuracy-improved through-silicon-via model using conformal mapping technique	T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏	2018-09-10T08:46:51Z	Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP	C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:46:50Z	Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules	C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:18:42Z	A stopband enhanced EBG power/ground plane based on via location design	C.-D. Wang;T.-L. Wu; C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:18:42Z	Conformal shielding investigation for SiP modules	C.-H. Huang;C.-Y. Hsiao;C.-D Wang;T. Chen;K.-H. Liao;T.-L. Wu; C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:18:41Z	Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure	A. C. Scogna;C.-D. Wang;A. Orl;i;T.-L. Wu; A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:18:40Z	Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology	T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin
國立聯合大學	2008	Lateral stresses caused by uniform rectangular area loads on a cross-anisotropic backfill	C. D. Wang
國立聯合大學	2007	Lateral Force and Centroid Location Caused by Horizontal and Vertical Surcharge Strip Loads on a Cross-Anisotropic Backfill	C. D. Wang
國立聯合大學	2007	Lateral Force Induced by Rectangular Surcharge Loads on a Cross-Anisotropic Backfill	C. D. Wang
國立聯合大學	2004	Three-Dimensional Non-linearly Varying Rectangular Loads on a Transversely Isotropic Half-Space	C. D. Wang
國立聯合大學	2003	Displacements and Stresses Due to a Vertical Subsurface Loading for Cross-Anisotropic Half-Spaces	C.D. Wang
國立聯合大學	2003	Three-Dimensional Non-linearly Varying Rectangular Loads on a Transversely Isotropic Half-Space	C.D. Wang

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