臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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"c h chien"

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Showing items 31-40 of 78 (8 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2006	Stability of the warpage in a PBGA package subjected to hygro-thermal loading	C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立高雄第一科技大學	2005.12	Potential Exposure to VOCs Caused by Dry Process Photocopiers: Results From a Chamber Study.	D.-J.Hsu;H.-L.Huang;C.-H.Chien;T.-S.Lin
國立中山大學	2005-05	Analytical Study of Thermal Modeling and Thermal Stress for Friction Stir Welding	C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學	2005	Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding	C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學	2005	Study on The Geometry of Microball Lens Array by Novel Batch-fabrication Technique	C.H. Chien; C.T. Pan; C.C. Hsieh; C.M. Yang; K.L. Sher
國立中山大學	2005	A study of the geometry of microball lens arrays using the novel batch-fabrication technique	C.H. Chien; C.T. Pan; C.C. Hesieh
國立中山大學	2005	An interfacial investigation of high dielectric constant material hafnium oxide on Si substrate	S.C. Chen;J.C. Lou;C.H. Chien;P.T. Liu;T.C. Chang
國立高雄第一科技大學	2004.04	Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling	C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
國立中山大學	2004-12	The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis	C.H. Chien; C.T. Pan; C.M. Yang; C.C. Hsieh
國立中山大學	2004-12	Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding	C.H. Chien; T.P. Chen; Y.J. Chao

Showing items 31-40 of 78 (8 Page(s) Totally)
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