臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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"c h chien"

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Showing items 46-55 of 78 (8 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2004-05-16	Hygro-Thermal Buckling Of A Thin PBGA Package	C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學	2004-03	Study of Thermal and Heat Transfer Phenomenon in Friction Stir Welding of Aluminum Alloy 6061-T6 Thick Plates	S. Liu; Y.J. Chao; C.H. Chien
國立中山大學	2004	Numerical Method to Predict and Fabricate Aspherical Micro-lens Array Using 248nm Excimer Laser Ablation	C.T. Pan; S.C. Shen; C.C. Hsieh; C.H. Chien; Y.C. Chen
國立中山大學	2004	Technique of Microball Lens Formation for Efficient Optical Coupling	C.T. Pan; C.H. Chien; C.C. Hsieh
國立中山大學	2004	Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06-02	Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06	Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學	2003	Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process	C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學	2002	The Measurement of Interfacial Strength of IC Package by Moire Interferometry	C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學	2002	The effect of moisture o?n the interfacial adhesion of IC packages	C.H. Chien; D.J. Weng; Y.T. Chiou; M.L. Tsai; Y.C. Chen

Showing items 46-55 of 78 (8 Page(s) Totally)
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