臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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"c h chien"

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Showing items 51-60 of 78 (8 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2003-06-02	Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06	Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學	2003	Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process	C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學	2002	The Measurement of Interfacial Strength of IC Package by Moire Interferometry	C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學	2002	The effect of moisture o?n the interfacial adhesion of IC packages	C.H. Chien; D.J. Weng; Y.T. Chiou; M.L. Tsai; Y.C. Chen
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立中山大學	1998	The quantitative analysis of a two-medium mixture using holographic interferometry: the determination of the size corresponding to circular- and rectangular-column voids in a two-medium mixture	C.H. Chien; Y.T. Chiou; C.C. Lee; Y.W. Liou; S.T. Chen
國立中山大學	1997	The study of Residual stress Effect on the Mode I Stress Intensity Factor in AL 6061-T6 Aluminum Plate by the Reflected Shadow Method	C.H. Chien; Y.T. Chiou
國立中山大學	1997	Extending the Laser- Specklegram Technigue to Residual Displacement Analysis of Weldment	C.H. Chien; Y.T. Chiou
國立中山大學	1997	lnspection of plates with Regions of Local Thirming as Defects by Hybrid Method of HoIographic lnterferometry and Finite Element Method	C.H. Chien; Y.T. Chion; M.C. Jong

Showing items 51-60 of 78 (8 Page(s) Totally)
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