臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	Sep-19	Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures	C. H. Yang; Y. W. Lee; C. Y. Lee; C. H. Chang; Cheng-En Ho
元智大學	Oct-16	High Dispersion of 1-nm SnO2 Particles between Graphene Nanosheets Constructed Using Supercritical CO2 Fluid for Sodium-ion Battery Anodes	J. Patra; H.C. Chen; C.H. Yang; C.Y. Su; Chien-Te Hsieh; J.K. Chang
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學	May-19	Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship	B. C. Huang; C. H. Yang; C. Y. Lee; Y. L. Hu; C. C. Hsu; Cheng-En Ho
元智大學	Mar-20	Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification	C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Jun-19	Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu	C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho

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