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Showing items 11-20 of 95  (10 Page(s) Totally)
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Institution Date Title Author
元智大學 Dec-15 Formation Mechanism of Pinholes in Electroplated Cu Films and Its Mitigation C. C. Chen; C. H. Hsieh; Y. W. Lee; C. H. Yang; Cheng-En Ho
元智大學 Dec-15 Abnormal Depletion of Cu Metallization Pads in Line-bump-line Solder Joints under Electron Current Stressing Cheng-En Ho; C. H. Yang; C. T. Chen; B. Z. Chen
元智大學 Aug-20 Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學 Apr-19 In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學 Apr-17 Eco-efficient Synthesis of Highly Porous CoCO3 Anodes for Li+ and Na+ Storage Using Supercritical CO2 Precursors H.-Y. Li; C.-M. Tseng; C.-H. Yang; T.-C. Lee; C.-Y. Su; Chien-Te Hsieh; J.K. Chang
元智大學 Apr-16 Facile Electrochemical Preparation of Hierarchical Porous Structures to Enhance Manganese Oxide Charge-Storage Properties in Ionic Liquid Electrolytes C.-H. Yang; I-W. Sun; Chien-Te Hsieh; T.-Y. Wu; C.-Y. Su; J.-K. Chang
臺大學術典藏 2021-12-06T09:02:53Z The analyses and verification of in-vivo animal tests on the CMOS bone-guided cochlear implant microsystem X.H. Qian; Y.C. Wu; T.Y. Yang; C.H. Cheng; H.C. Chu; W.H. Cheng; T.Y. Yen; T.H. Lin; Y.J. Lin; Y.C. Lee; J.H. Chang; S.T. Lin; S.H. Li; T.C. Wu; C.C. Huang; C.F. Lee; C.H. Yang; C.C. Hung; T.S. Chi; C.H. Liu; M.D. Ker; C.Y. Wu; CHIEN-HAO LIU
臺大學術典藏 2020-10-07T01:24:51Z Microvascular imaging using swept-source optical coherence tomography with single-channel acquisition M-T Tsai;T-D Chi;H-L Liu;F-Y Chang;C-H Yang;C-K Lee;C-C Yang; M-T Tsai; T-D Chi; H-L Liu; HAO-LI LIU; 劉浩澧; C-K Lee; C-C Yang; F-Y Chang; C-H Yang; H-L Liu; T-D Chi; F-Y Chang; C-H Yang; C-K Lee; C-C Yang; HAO-LI LIU; M-T Tsai
元智大學 2019/11/15 White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學 2019/11/15 White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho

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