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Showing items 26-35 of 94 (10 Page(s) Totally)
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| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
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Hung H.T;Yang S;Shih P.S;Ma Z.D;Huang J.H;Kao C.R.; Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology
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Lu P.-Y;Li Y.-R;Yen C.-M;Hung H.-T;Kao C.-R;Pu W.-C;Chen C.-C.A;Lee M.-H;Liao M.-H.; Lu P.-Y; Li Y.-R; Yen C.-M; Hung H.-T; Kao C.-R; Pu W.-C; Chen C.-C.A; Lee M.-H; Liao M.-H.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
Interconnections of low-temperature solder and metallizations
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Wang Y;Kao C.R.; Wang Y; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-02-04T02:49:00Z |
The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance
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Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO; WEI-JIUN SU; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:12Z |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
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C. ROBERT KAO;Kao C.R.;Ho C.E.;Huang C.G.;Jain T.A.; Jain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:11Z |
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
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C. ROBERT KAO;Kao C.R.;Chen C.;Ho C.E.; Ho C.E.; Chen C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:09Z |
New failure mode induced by electric current in flip chip solder joint
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C. ROBERT KAO;Kao C.R.;Tsai J.;Hu Y.C.;Lin Y.H.; Lin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization
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C. ROBERT KAO;Kao C.R.;Tsai J.Y.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
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C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages
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C. ROBERT KAO;Kao C.R.;Tsai J.;Lin Y.L.; Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO |
Showing items 26-35 of 94 (10 Page(s) Totally)
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