English  |  正體中文  |  简体中文  |  2875274  
???header.visitor??? :  54616795    ???header.onlineuser??? :  2407
???header.sponsordeclaration???
 		 
???search.scope??? ???search.advance???
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???
???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
Repositories
Author
Title
Date
???ui.leftmenu.statisticschart???
???ui.leftmenu.realtimefacts???
???ui.leftmenu.trend???

???index.news???
2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
發佈

???ui.leftmenu.copyrighttitle???
???ui.leftmenu.copyrightpublisher???
???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
機構典藏計畫網站
ROAR
OpenDOAR
SHERPA
OAIster
JAIRO
Ira
DSPACE
RWWR
臺大學術典藏NTU Scholars
???tair.name??? >  ???browser.page.title.author???

"c robert kao"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 41-50 of 94  (10 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 10 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2019-11-27T02:02:56Z Massive spalling of intermetallic compound in lead-free solder joints C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu C. ROBERT KAO;Kao C.R.;Yang S.C.; Yang S.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Tin whisker growth induced by high electron current density C. ROBERT KAO;Kao C.R.;Lin Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:52Z Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:52Z Microstructure study of high lead bump FCBGA bending test C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y.; Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:52Z Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S.; Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:49Z Development of lead-free solders with superior drop test reliability performance C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:48Z Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO

Showing items 41-50 of 94  (10 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 10 > >>
View [10|25|50] records per page

DSpace Software Copyright © 2002-2004  MIT   &  Hewlett-Packard   /   Enhanced by   NTU Library IR team