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机构 日期 题名 作者
國立交通大學 2014-12-08T15:49:14Z Dielectric tunability of barium strontium titanate/silicone-rubber composite Liou, JW; Chiou, BS
國立交通大學 2014-12-08T15:49:13Z Effect of reactive ion etching and post-etching annealing on the electrical characteristics of indium-tin oxide silicon junctions Chiou, BS; Wu, KL
國立交通大學 2014-12-08T15:49:11Z Effect of MgO addition on the electrical transport properties of highly Sb-doped BaTiO3 ceramics Chiou, BS; Wang, IH
國立交通大學 2014-12-08T15:47:36Z Spectral properties of Eu3+-activated yttrium oxysulfide red phosphor Tseng, YH; Chiou, BS; Peng, CC; Ozawa, L
國立交通大學 2014-12-08T15:46:34Z Electromigration in sputtered copper films on polyimide Wang, HW; Chiou, BS; Jiang, JS
國立交通大學 2014-12-08T15:46:16Z Antireflective coating for ITO films deposited on glass substrate Chiou, BS; Tsai, JH
國立交通大學 2014-12-08T15:45:46Z Barrier layer effect of titanium-tungsten on the electromigration in sputtered copper films on polyimide Wang, HW; Chiou, BS
國立交通大學 2014-12-08T15:45:14Z The effect of substrate surface roughness on the wettability of Sn-Bi solders Chen, YY; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:44:43Z Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints Miao, HW; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:44:43Z Analysis of the dielectric characteristics for polycrystalline Ba(0.65)Sr(0.35)TiO(3) (I)-frequency dependence in the paraelectric state Liou, JW; Chiou, BS
國立交通大學 2014-12-08T15:44:43Z Analysis of the dielectric characteristics for polycrystalline Ba0.65Sr0.35TiO3 (II) - d.c. field dependence with a modified bias equation Liou, JW; Chiou, BS
國立交通大學 2014-12-08T15:44:33Z Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect Chin, YL; Chiou, BS; Wu, WF
國立交通大學 2014-12-08T15:44:24Z The effect of polyimide passivation on the electromigration of Cu multilayer interconnections Jiang, JS; Chiou, BS
國立交通大學 2014-12-08T15:44:11Z The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders Lin, JD; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:43:53Z Wettability of electroless Ni in the under bump metallurgy with lead free solder Young, BL; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:43:38Z Luminescent mechanisms of ZnS : Cu : Cl and ZnS : Cu : Al phosphors Chen, YY; Duh, JG; Chiou, BS; Peng, CG
國立交通大學 2014-12-08T15:43:31Z Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusion method Lo, CL; Duh, JG; Chiou, BS; Peng, CC; Ozawa, L
國立交通大學 2014-12-08T15:43:06Z Novel chip standby current prediction model and ultrathin gate oxide scaling limit Su, HD; Chiou, BS; Lu, PC; Chang, MH; Lee, KH; Chao, CP; See, YC; Sung, JYC
國立交通大學 2014-12-08T15:43:06Z Curing of polyimide and the effect of the TEOS SiO2 barrier layer on the electromigration of sputtered Cu with polyimide passivation Hung, HY; Chiou, BS
國立交通大學 2014-12-08T15:43:05Z Current-temperature characteristics of low-temperature-sputtered (Ba,Sr)TiO3 films post treated by rapid thermal annealing Shye, DC; Chen, JS; Kuo, MW; Chou, BCS; Jan, CK; Wu, MF; Chiou, BS; Cheng, HC
國立交通大學 2014-12-08T15:43:00Z The effect of ZnS content on the luminescence and electrical properties of ZnO : Zn phosphor Lin, CH; Chiou, BS; Chang, CH; Lin, JD
國立交通大學 2014-12-08T15:42:28Z Barrier layer effect of tantalum on the electromigration in sputtered copper films on hydrogen silsesguioxane and Si0(2) Sung, WL; Chiou, BS
國立交通大學 2014-12-08T15:42:26Z Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect Chin, YL; Chiou, BS; Wu, WF
國立交通大學 2014-12-08T15:42:16Z Low-voltage cathodoluminescence properties of the Y2O2S : Eu red light emitting phosphor screen in field-emission environments Lo, CL; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:41:51Z Microstructure characteristics for anorthite composite glass with nucleating agents of TiO2 under non-isothermal crystallization Lo, CL; Duh, JG; Chiou, BS; Lee, WH

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