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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立交通大學 2014-12-08T15:40:02Z Effects of underlayer dielectric on the thermal characteristics and electromigration resistance of copper interconnect Chin, YL; Chiou, BS
國立交通大學 2014-12-08T15:39:46Z Effects of thermal stabilities for the ultra thin chromium layers applied on (Ba,Sr)TiO3 thin films Kuo, MW; Shye, DC; Chiou, BS; Chen, JS; Cheng, HC
國立交通大學 2014-12-08T15:39:33Z The effects of surface-plasma treatment of thin-film hydrogen silesquioxane low k dielectric Chen, CT; Chiou, BS
國立交通大學 2014-12-08T15:39:33Z Effect of glass additions on the sintering behaviors and electrical microwave properties of BaO-Nd2O3-Sm2O3-TiO2 ceramics Chang, LC; Chiou, BS; Lee, WH
國立交通大學 2014-12-08T15:39:26Z Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric Chen, CT; Chiou, BS
國立交通大學 2014-12-08T15:38:56Z Effect of B2O3 nano-coating on the sintering behaviors and electrical microwave properties of Ba(Nd2-xSmx)Ti4O12 ceramics Chang, LC; Chiou, BS
國立交通大學 2014-12-08T15:38:51Z Electromigration and integration aspects for the copper-SiLK system Tseng, HS; Chiou, BS; Wu, WF; Ho, CC
國立交通大學 2014-12-08T15:36:45Z The effect of In2O3 conductive coating on the luminescence and zeta potential of ZnS : Cu, Al phosphors Chang, CH; Chiou, BS; Chen, KS; Ho, CC; Ho, JC
國立交通大學 2014-12-08T15:27:50Z FABRICATION AND CHARACTERISTICS OF RF MAGNETRON-SPUTTERED ITO THIN-FILMS WU, WF; CHIOU, BS
國立交通大學 2014-12-08T15:27:07Z Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation Chiou, BS; Jiang, JS; Wang, HW; Hung, HY
國立交通大學 2014-12-08T15:26:34Z Characteristics of low-temperature-prepared (Ba, Sr)TiO3 films post treated by novel excimer laser annealing Shye, DC; Chiou, BS; Hwang, CC; Chen, JS; Su, IW; Chou, CC; Cheng, HC
國立交通大學 2014-12-08T15:25:39Z The feasibility of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packaging Lin, CT; Chiou, BS; Chi, S
國立交通大學 2014-12-08T15:25:37Z The weldability study of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packages Lin, CT; Chiou, BS; Wang, SC; Chi, S
國立交通大學 2014-12-08T15:19:19Z Characterization and conductive coating of phosphors for improved brightness Chang, CH; Chiou, BS; Chen, KS; Ho, JC
國立交通大學 2014-12-08T15:18:32Z Electrical Behavior of BaO-Nd2O3-SM2O3-TiO2 with glass/oxide additives analyzed by impedance spectroscopy Chang, LC; Chiou, BS
國立交通大學 2014-12-08T15:17:40Z Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder Lin, YC; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:17:18Z S-parameters-based high speed signal characterization of Al interconnect on low-k hydrogen silsesquioxane-Si substrate Ho, CC; Chiou, BS
國立交通大學 2014-12-08T15:06:18Z GLASSES FOR HIGH-TEMPERATURE THICK-FILM SYSTEMS CHIOU, BS; VEST, RW
國立交通大學 2014-12-08T15:06:15Z HIGH-TEMPERATURE THICK-FILM DIELECTRICS CHIOU, BS; VEST, RW
國立交通大學 2014-12-08T15:06:10Z ELECTRICAL-PROPERTIES AND DEGRADATION PHENOMENA OF GLASS-DOPED ZNO VARISTORS CHIOU, BS; JIH, FW
國立交通大學 2014-12-08T15:06:09Z DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESS CHIOU, BS; HSU, WY; DUH, JG
國立交通大學 2014-12-08T15:06:04Z MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDE CHIOU, BS; RAU, HL; CHANG, PH; DUH, JG
國立交通大學 2014-12-08T15:06:02Z THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICS CHIOU, BS; KOH, CM; DUH, JG
國立交通大學 2014-12-08T15:06:01Z THERMOLUMINESCENT RESPONSE OF THULIUM ACTIVATED CALCIUM FLUORIDES TO COPPER K-ALPHA X-RADIATION CHIOU, BS; LIU, JI; HSU, PC; WENG, PS
國立交通大學 2014-12-08T15:05:57Z BARRIER EFFECT OF E-BEAM EVAPORATED TUNGSTEN INTERLAYER IN AL/W/PTSI METALLIZATION LAYER CHIOU, BS; LO, HS; CHANG, PH

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