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显示项目 11-23 / 23 (共1页)
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机构 日期 题名 作者
臺北醫學大學 2012 Processing and mechanical properties of electrically conductive zirconia Chiou, Shi-Yung;Wang, Cui-Feng;Ou, Shih-Fu;Ou, Keng-Liang
臺北醫學大學 2012 Phase transformation of hydroxyapatite decomposition Ou, Shih-Fu;Chiou, Shi-Yung;Ou, Keng-Liang
臺北醫學大學 2012 Research of a silver-containing yttria-stabilized zirconia bioceramic with antibacterial activity Ou, Shih-Fu;Huang, Mao-Suan;Chiou, Shi-Yung;Ou, Keng-Liang
臺北醫學大學 2012 Phase transformation of hydroxyapatite decomposition Ou, Shih-Fu;Chiou, Shi-Yung;Ou, Keng-Liang
臺北醫學大學 2012 Processing and mechanical properties of electrically conductive zirconia Chiou, Shi-Yung;Wang, Cui-Feng;Ou, Shih-Fu;Ou, Keng-Liang
國立高雄應用科技大學 2009 Effect of plasma energy on enhancing biocompatibility and hemocompatibility of diamond-like carbon film with various titanium concentrations Cheng, Hsin-Chung; Chiou, Shi-Yung; Liu, Chung-Ming; Lin, Ming-Hong; Chen, Chang-Chih; Ou, Keng-Liang
國立高雄應用科技大學 2007 Enhancing the reliability of n+–p junction diodes using plasma treated tantalum barrier film Ou, Keng-Liang; Wu, Wen-Fa; Chiou, Shi-Yung
臺北醫學大學 2007 Enhancing the reliability of n(+)-p junction diodes using plasma treated tantalum barrier film 歐耿良; Ou,Keng-Liang; Wu,Wen-Fa; Chiou,Shi-Yung
臺北醫學大學 2005 Barrier capability of Hf-N films with various nitrogen concentrations against copper diffusion in Cu/Hf-N/n+-p junction diodes 歐耿良; Ou,Keng-Liang; Chiou,Shi-Yung; Lin,Ming-Hongn; Hsud,Ray-Quan
臺北醫學大學 2005 Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes 歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang
臺北醫學大學 2004 High Cu Diffusion Resistance in Ultrathin Multi-quasi-amorphous CVD-Ti/TiNx Films Ou,Keng-Liang; Chiou,Shi-Yung; Lin,Ming-Hong
臺北醫學大學 2004 Nanostructured TaN(O)/TaN barrier film formed by oxygen plasma treatment for copper interconnect Ou,Keng-Liang; Lin,Ming-Hong; Chiou,Shi-Yung
臺北醫學大學 2002 Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang

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