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"chiou shi yung"的相关文件
显示项目 11-23 / 23 (共1页) 1 每页显示[10|25|50]项目
| 臺北醫學大學 |
2012 |
Processing and mechanical properties of electrically conductive zirconia
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Chiou, Shi-Yung;Wang, Cui-Feng;Ou, Shih-Fu;Ou, Keng-Liang |
| 臺北醫學大學 |
2012 |
Phase transformation of hydroxyapatite decomposition
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Ou, Shih-Fu;Chiou, Shi-Yung;Ou, Keng-Liang |
| 臺北醫學大學 |
2012 |
Research of a silver-containing yttria-stabilized zirconia bioceramic with antibacterial activity
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Ou, Shih-Fu;Huang, Mao-Suan;Chiou, Shi-Yung;Ou, Keng-Liang |
| 臺北醫學大學 |
2012 |
Phase transformation of hydroxyapatite decomposition
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Ou, Shih-Fu;Chiou, Shi-Yung;Ou, Keng-Liang |
| 臺北醫學大學 |
2012 |
Processing and mechanical properties of electrically conductive zirconia
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Chiou, Shi-Yung;Wang, Cui-Feng;Ou, Shih-Fu;Ou, Keng-Liang |
| 國立高雄應用科技大學 |
2009 |
Effect of plasma energy on enhancing biocompatibility and hemocompatibility of diamond-like carbon film with various titanium concentrations
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Cheng, Hsin-Chung; Chiou, Shi-Yung; Liu, Chung-Ming; Lin, Ming-Hong; Chen, Chang-Chih; Ou, Keng-Liang |
| 國立高雄應用科技大學 |
2007 |
Enhancing the reliability of n+–p junction diodes using plasma treated tantalum barrier film
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Ou, Keng-Liang; Wu, Wen-Fa; Chiou, Shi-Yung |
| 臺北醫學大學 |
2007 |
Enhancing the reliability of n(+)-p junction diodes using plasma treated tantalum barrier film
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歐耿良; Ou,Keng-Liang; Wu,Wen-Fa; Chiou,Shi-Yung |
| 臺北醫學大學 |
2005 |
Barrier capability of Hf-N films with various nitrogen concentrations against copper diffusion in Cu/Hf-N/n+-p junction diodes
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歐耿良; Ou,Keng-Liang; Chiou,Shi-Yung; Lin,Ming-Hongn; Hsud,Ray-Quan |
| 臺北醫學大學 |
2005 |
Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes
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歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang |
| 臺北醫學大學 |
2004 |
High Cu Diffusion Resistance in Ultrathin Multi-quasi-amorphous CVD-Ti/TiNx Films
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Ou,Keng-Liang; Chiou,Shi-Yung; Lin,Ming-Hong |
| 臺北醫學大學 |
2004 |
Nanostructured TaN(O)/TaN barrier film formed by oxygen plasma treatment for copper interconnect
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Ou,Keng-Liang; Lin,Ming-Hong; Chiou,Shi-Yung |
| 臺北醫學大學 |
2002 |
Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment
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Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang |
显示项目 11-23 / 23 (共1页) 1 每页显示[10|25|50]项目
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