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"chiu s h"
Showing items 91-100 of 144 (15 Page(s) Totally)
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| 國立臺灣科技大學 |
2015 |
Biodegradable composition of poly(lactic acid) from renewable wood flour
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Tsou, C.-Y.;Wu, C.-L.;Tsou, C.-H.;Chiu, S.-H.;Suen, M.-C.;Hung, W.-S. |
| 國立臺灣科技大學 |
2015 |
Optimization of process parameters for dimensional accuracy in an area-forming rapid prototyping system using the Taguchi method
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Chiu, S.-H.;Chen, Chen C.-C.;Chen, K.-T.;Su, C.-H. |
| 國立交通大學 |
2014-12-08T15:24:57Z |
Joule heating effect under accelerated electromigration in flip-chip solder joints
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Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:15:51Z |
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
|
Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:15:11Z |
Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy
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Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
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Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:33Z |
Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints
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Chang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:07:38Z |
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
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Chang, Y. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:06:49Z |
Effects of current crowding and Joule heating on reliability of solder joints
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Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立臺灣科技大學 |
2014 |
New composition of maleic-anhydride-grafted poly(Lactic Acid)/rice husk with methylenediphenyl diisocyanate
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Tsou, C.-H.;Hung, W.-S.;Wu, C.-S.;Chen, J.-C.;Huang, C.-Y.;Chiu, S.-H.;Tsou, C.-Y.;Yao, W.-H.;Lin, S.-M.;Chu, C.-K.;Hu, C.-C.;Lee, K.-R.;Suen, M.-C. |
Showing items 91-100 of 144 (15 Page(s) Totally)
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