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Institution Date Title Author
國立交通大學 2019-06-03T01:08:36Z A Flip-Chip-Assembled W-Band Receiver in 90-nm CMOS and IPD Technologies Li, Chun-Hsing; Hsieh, Wan-Ting; Chiu, Te-Yen
國立交通大學 2019-04-02T06:00:34Z Single Flip-Chip Packaged Dielectric Resonator Antenna for CMOS Terahertz Antenna Array Gain Enhancement Li, Chun-Hsing; Chiu, Te-Yen
臺大學術典藏 2019-04-01 A flip-chip-assembled W-band receiver in 90-nm CMOS and IPD technologies Chiu, Te Yen; CHUN-HSING LI; Hsieh, Wan Ting
國立交通大學 2018-08-21T05:57:07Z Enhancement of CMOS THz Imaging Sensing By Packaging Technology Kuo, Chien-Nan; Chen, Wei-Cheng; Chiu, Te-Yen; Li, Chun-Hsing

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