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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2019-06-03T01:08:36Z |
A Flip-Chip-Assembled W-Band Receiver in 90-nm CMOS and IPD Technologies
|
Li, Chun-Hsing; Hsieh, Wan-Ting; Chiu, Te-Yen |
| 國立交通大學 |
2019-04-02T06:00:34Z |
Single Flip-Chip Packaged Dielectric Resonator Antenna for CMOS Terahertz Antenna Array Gain Enhancement
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Li, Chun-Hsing; Chiu, Te-Yen |
| 臺大學術典藏 |
2019-04-01 |
A flip-chip-assembled W-band receiver in 90-nm CMOS and IPD technologies
|
Chiu, Te Yen; CHUN-HSING LI; Hsieh, Wan Ting |
| 國立交通大學 |
2018-08-21T05:57:07Z |
Enhancement of CMOS THz Imaging Sensing By Packaging Technology
|
Kuo, Chien-Nan; Chen, Wei-Cheng; Chiu, Te-Yen; Li, Chun-Hsing |
Showing items 1-4 of 4 (1 Page(s) Totally)
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