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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2016-09 On the mechanics of laser peeling for ultra-thin glasses Chiu, Tz-Cheng; Hua, Chi-An; Wang, Chih-Han; Chen, Kuo-Shen; Yang, Tian-Shiang; Wen, Chang-Da; Li, Chun-Han; Lin, Mao-Chi; Huang, Chien-Jung; Chen, Kun-Tso
國立成功大學 2015-10 In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates Hsu, Hsueh Hsien; Chen, Hao; Ouyang, Yao Tsung; Chiu, Tz Cheng; Chang, Tao Chih; Lee, Hsin Yi; Ku, Chin Shun; Wu, Albert T.
國立成功大學 2014-08 Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium Tsai, Shang-Wu; Chiu, Tz-Cheng; Chue, Ching-Hwei
國立成功大學 2014-01 Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis Hsu, Hsueh-Hsien; Chiu, Tz-Cheng; Chang, Tao-Chih; Huang, Shin-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Lin, Yang-Yi; Su, Chien-Hao; Chou, Li-Wei; Ouyang, Yao-Tsung; Huang, Yi-Ting; Wu, Albert T.
國立成功大學 2013-12 Heat conduction in a functionally graded medium with an arbitrarily oriented crack Chiu, Tz-Cheng; Tsai, Shang-Wu; Chue, Ching-Hwei
國立成功大學 2012-07 A numerical procedure for simulating delamination growth on interfaces of interconnect structures Chiu, Tz-Cheng; Chen, Chun-Hui
國立成功大學 2011-06 Effects of Curing and Chemical Aging on Warpage-Characterization and Simulation Chiu, Tz-Cheng; Kung, Che-Li; Huang, Hong-Wei; Lai, Yi-Shao
國立成功大學 2009-03 Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique Chiu, Tz-Cheng; Lin, Huang-Chun
國立成功大學 2008-06 On the homogenization of multilayered interconnect for interfacial fracture analysis Chiu, Tz-Cheng; Lin, Huang-Chun

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